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1.
Thermal Management of Microelectronic Equipment
Thermal Management of Microelectronic Equipment
By: Lian-Tuu Yeh, D. Agonafer
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
AED2,064
Binding:
Hardback
Release:
01 Jun 2016
Language:
English
International Edition
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2.
Microchannel Heat Sink
Microchannel Heat Sink
By: Shahi Riaz, Dereje Agonafer
Publisher: VDM Verlag
No Review Yet
AED511
Binding:
Paperback
Release:
27 May 2010
Language:
English
Out of Stock
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3.
Application of CAE/CAD to Electronic Systems
Application of CAE/CAD to Electronic Systems
By: D.; Fulton Agonafer
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
AED719
Binding:
Hardback
Release:
01 Jan 1996
Language:
English
Out of Stock
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4.
Application of Heat Transfer in Microelectronic Packaging
Application of Heat Transfer in Microelectronic Packaging
By: Et Al, D. Agonafer, C.H. Amon
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
AED814
Binding:
Hardback
Release:
01 Jan 1997
Language:
English
Out of Stock
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5.
Solutions to CFD Benchmark Problems in Electronic Packaging
Solutions to CFD Benchmark Problems in Electronic Packaging
By: A. Agonafer
No Review Yet
AED303
Binding:
Paperback
Out of Stock
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6.
Contending Theories of Development
Contending Theories of Development
By: Mulugeta Agonafer
Publisher: University Press of America
No Review Yet
AED592
Binding:
Hardback
Release:
11 Oct 1994
Language:
English
Out of Stock
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7.
Computer Aided Design in Electronic Packaging
Computer Aided Design in Electronic Packaging
By: R.E. Fulton, A. Agonafer
No Review Yet
AED303
Binding:
Hardback
Out of Stock
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