Noise Coupling in System-on-Chip
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Noise Coupling in System-on-Chip

Noise Coupling in System-on-Chip

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International Edition


About the Book

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Table of Contents:
System on Chip Substrate Crosstalk Modeling and Simulation Flow. Substrate Induced Signal Integrity in 2D and 3D Ics. TSV-to-Substrate Noise Coupling in 3-D Systems. 3-D Interconnects with IC’s Stack Global Electrical Context Consideration. Modeling of On-Chip Power Distribution Network. Printed Circuit Board Integration of SoC Packages and Signal Integrity Issues at Board Level. Modeling and Characterization of TSV-Induced Noise Coupling. Layout strategies for substrate crosstalk reduction in low cost CMOS processes. Wireless Communications System on Chip substrate noise real time sensing. System-on-Chip Substrate Crosstalk Measurement Techniques. IC Floorplanning Based on Thermal Interactions. A Unified Method for Calculating Parasitic Capacitive and Resistive Coupling in VLSI Circuits. Coupling through substrate for millimeter wave frequencies. Paradigm Shift of On-Chip Interconnects from Electrical to Optical. Electro-Thermal Considerations dedicated to 3-D Integration; Noise Coupling.


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Product Details
  • ISBN-13: 9781498796774
  • Publisher: Taylor & Francis Inc
  • Publisher Imprint: CRC Press Inc
  • Height: 234 mm
  • No of Pages: 518
  • Width: 156 mm
  • ISBN-10: 149879677X
  • Publisher Date: 27 Dec 2017
  • Binding: Hardback
  • Language: English
  • Weight: 997 gr


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