Multichip Modules with Integrated Sensors

Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

Table of Contents:
Preface.- Reliability Effects for MCM and Sensors.- “Thermal Investigations of Microsystems,”.- “Failure Analysis of Migrated Short Circuits in MCMs Using Soldering,”.- “Internal Liquid Cooling of Integrated Circuits and Multichip Modules,”.- “Holographic and Thermal Diagnostics of Integrated Circuits,”.- “Accelerated Life Tests of Ultrasonic Wire Bonds,”.- “The Methods of Improving Radiation Resistance of Hybrid Integral Circuits Elements,”.- “Wire Bonding to Multichip Modules and Other Soft Substrates,”.- MCM-C.- “MCMs for Computers and Telecom in CHIPPAC Programme,”.- “Buried Passive Component Realization in Low Temperature Cofired Ceramic for MCM-C Substrate Applications,”.- “A Novel Transcutaneous Blood oxygen Sensor Based on MCM-C Technology,”.- “Advanced Thick Film Techniques for Multilayer Structures and Sensors,”.- MCM-D/L.- “Some Investigations on Wiring in New Generation Multichip Modules Applied in High Speed Large Scale Integrated Telecommunication Units,”.- “Some Chapters from the COB Technology,”.- “Thin Film Multichip Modules Based on Photosensitive Benzocyclobutene,”.- Sensors.- “Thin Film Thermal Microsensors,”.- “Electrical Properties of Thick Film PTC Composition”.- “Current Research on Thin and Thick Film Sensors at the Department of Electronics, University of Mining and Metallurgy in Krakow,”.- “Materials and Devices for Fiber Optic Sensors,”.- “Integration Techniques for Smart Sensors,”.- “Micro-Machined Accelerometers for MCM Integration,”.- “Research into Novel Sensors on Silicon Substrates,”.- System Requirements and Integration.- “From Multichip Modules (MCMs) to Micro System Modules (MSMs),”.- “Prototyping of Multichip Modules - Theory, Services, andAssessment,”.- “BARMINT Project for Promoting Standards in Microsystem Integration,”.- “A Hybrid Integrated Gassensor on Silicon,”.- ISHM-Hungary Poster Papers.- “Investigation of Ultraviolet Laser Induced Conductive Layer of Silver Salt Filled Polyimide Films,”.- “57Fe and 57Co Mössbauer Study of Suppression of Superconductivity in PrBa2Cu307-d,”.- “Plastic PGA-64 Packages,”.- “Analysis of Laser Induced Surface Effects on A£N Substrates,”.- “Structural and Electrical Characterization of AIGeNi/n-GaAs Contacts,”.- “Buried Vias in Multilayer Printed Wiring Boards,”.- “Surface Pattern Formation and the Volatile Component Loss of Heat Treated Pd/InP and Au/InP Samples,”.- “Polymer Thick-Film Pressure Sensor,”.- Author Index.- Keyword Index.