Thermal Management of Electronic Systems II - Bookswagon UAE
Book 1
Book 2
Book 3
Book 1
Book 2
Book 3
Book 1
Book 2
Book 3
Book 1
Book 2
Book 3
Home > Science, Technology & Agriculture > Energy technology and engineering > Electrical engineering > Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium
36%
Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium


     0     
5
4
3
2
1



Available


X
About the Book

For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Table of Contents:
1. Invited Lectures.- The Numerical Modelling of Heat Transfer in Electronic Systems : Challenges and Ideas of Answer.- DELPHI — A Status Report on the ESPRIT funded Project for the Creation and Validation of Thermal Models of Electronic Parts.- Temperature Effects on Reliability.- 2. Analytical and Computational Thermal Modeling.- Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications — Experimental Validation.- Conjugate Model of a Pinned-Finned Heat-sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool.- Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits.- Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips.- Electrothermal Simulation of Analogue Integrated Circuits with ETS.- Calculations of the Temperature Distribution throughout Electronic Equipments by the Boundary Element Method.- An Interactive Thermal Characterisation of Component Placement.- 3. Thermal Characterisation.- Thermal Characterization of Electronic Devices by means of Improved Boundary Condition Independent Compact Models.- Experimental Validation Methods for Thermal Models.- Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment.- Modelling of IC-Packages based on Thermal Characteristics.- Characterisation of Thermally Enhanced Plastic Packages.- Thermal Characterization of Multistripe Heterostructure Lasers.- Application of Thermal Territories for Air Cooled Circuit Board Design.- Thermal Impedance Evaluation for Industrial Power Profiles.- Thermal Characterisation and Modélisation of Multichip Modules using Standard Electronic Packages.- Measurement of Practical Thermal Resistance Values for Multi-CavitiesPower Hybrids (MCPH) in a Vacuum Environment.- 4. Single and Multi-Phase Convective Cooling.- Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components.- Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package.- High Performance Air Cooled Heat-sinks for Power Packages.- Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates.- Natural Convection Experiments with Cuboids and Cylinders of Equal Area.- Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate.- 5. Measurement Techniques.- Visualisation of Natural Convection in Inclined Heated Parallel Plates.- New Jedec Standards for Thermal Measurements: Review and Examples.- Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components.- Modelling of Axial Fans for Electronic Equipment.- 6. Thermomechanical Modelling.- Thermal Degradation of Power Modules.- Thermal and Thermomechanical Modelling of Ball Grid Array Packages.- Thermal and Thermomechanical Evaluation of a “Chip in Moulded Interconnect Device”.- Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis.- Author Index.


Best Sellers


Product Details
  • ISBN-13: 9789401063180
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Height: 240 mm
  • No of Pages: 361
  • Returnable: N
  • Width: 160 mm
  • ISBN-10: 9401063184
  • Publisher Date: 05 Nov 2012
  • Binding: Paperback
  • Language: English
  • Returnable: N
  • Sub Title: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium
Springer -
Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    Fresh on the Shelf


    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!