Quantum Computing Architecture and Hardware for Engineers
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Quantum Computing Architecture and Hardware for Engineers: Step by Step

Quantum Computing Architecture and Hardware for Engineers: Step by Step


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About the Book

The purpose of this book is to teach quantum computing hardware from an engineer’s perspective. Engineers play an important role in quantum computers. However, college and graduate engineering students usually do not have the required physics and mathematics training to understand how quantum computer hardware works. This book provides step-by-step guidance to connect engineers to the quantum world. Prepares readers with the essential mathematics and physics skills to understand and design quantum computers. Covers spin qubits and superconducting qubits in a unified framework. Uses language accessible to readers with varying backgrounds and a step-by-step approach. Includes simulation codes and superconducting quantum chip design examples. Discusses step-by-step the physics, mathematics, and their connection to microwave electronics based on how they fulfill the five DiVincenzo’s criteria.

Table of Contents:
Part I: Overview of Quantum Computers and Review of Essential Quantum Mechanics.- Chapter 1: Quantum Computer Hardware and Architecture - An Overview.- Chapter 2: Linear Algebra - Vectors, States, and Measurement.- Chapter 3: Linear Algebra - Operators, Matrices and Quantum Gates.- Chapter 4: Schrodinger Equation and Quantum Gates.- Chapter 5: Bloch Sphere, Quantum Gates, and Pauli Matrices.- Chapter 6: Density Matrix and the Bloch Sphere.- Part II: Silicon Spin Qubit Architecture and Hardware.- Chapter 7: Spin Qubit - Preliminary Physics.- Chapter 8: Spin Qubit - Larmor Precession - Phase Shift Gate.- Chapter 9: Spin Qubit - Rabi Oscillation.- Chapter 10: Spin Qubit - Rabi Oscillation under Rotating Field using Rotating Frame.- Chapter 11: Electron Spin Qubit in Semiconductor - Implementation, Initialization and Readout.- Chapter 12: Electron Spin Qubit in Semiconductor - 1-Qubit and 2-Qubit Gates.- Part III: Superconducting Qubit Architecture and Hardware.- Chapter 13: Lagrangian Mechanics and Hamiltonian Mechanics.- Chapter 14: Quantization of Simple Harmonic Oscillator.- Chapter 15: Quantization of an LC Tank - a Bad Qubit.- Chapter 16: Superconductor and Josephson Junction.- Chapter 17: Cooper Pair Box Qubit - Hamiltonian.- Chapter 18: Cooper Pair Box - Analytical Solution.- Chapter 19: Cooper Pair Box - Numerical Solution.- Chapter 20: Charge Qubit Dynamics - Precession and 1-Qubit Gate.- Chapter 21: Transmon Qubit - 1-Qubit and 2-Qubit Gates.- Chapter 22: Superconducting Qubit - Readout and Initialization.- Part IV: Design and Implementation.- Chapter 23: Microwave Electronics in Quantum Computers.- Chapter 24: Design of Integrated Superconducting Qubit Chip.- Chapter 25: Errors and Decoherence.

About the Author :
Hiu Yung Wong is an Associate Professor at San Jose State University. He received his Ph.D. degree in Electrical Engineering and Computer Science from the University of California, Berkeley in 2006. From 2006 to 2009, he worked as a Technology Integration Engineer at Spansion. From 2009 to 2018, he was a TCAD Senior Staff Application Engineer at Synopsys. He received the Industry Sponsored Research Award and ERFA RSCA Award in 2024, the AMDT Endowed Chair Award, the Curtis W. McGraw Research Award from ASEE Engineering Research Council in 2022, the NSF CAREER award and the Newnan Brothers Award for Faculty Excellence in 2021, and Synopsys Excellence Award in 2010. He is the author of the book, "Introduction to Quantum Computing: From a Layperson to a Programmer in 30 Steps". He is one of the founding faculties of the Master of Science in Quantum Technology at San Jose State University. His research interests include the application of machine learning in simulation and manufacturing, cryogenic electronics, quantum computing, and wide bandgap device simulations. His works have produced 1 book, 1 book chapter, more than 120 papers, and 10 patents.


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Product Details
  • ISBN-13: 9783031782183
  • Publisher: Springer International Publishing AG
  • Publisher Imprint: Springer International Publishing AG
  • Height: 235 mm
  • No of Pages: 371
  • Sub Title: Step by Step
  • ISBN-10: 3031782186
  • Publisher Date: 28 Mar 2025
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Width: 155 mm


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