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Home > Science, Technology & Agriculture > Electronics and communications engineering > Electronics engineering > Electronic devices and materials > Handbook of Smart Systems and Materials
Handbook of Smart Systems and Materials

Handbook of Smart Systems and Materials


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About the Book

In recent years the multidisciplinary technology covered by smart materials, smart structures, intelligent structures, and microelectromechanical systems (MEMS) has generated significant interest in the engineering, medical, scientific, and industrial communities. Smart materials sense changes in their environments and respond usefully by changing their material properties, geometry, mechanical, and electromechanical responses. MEMS refers to a collection of microsensors and actuators that can both sense and react to their environment. Grouped together under the term "smart materials and devices" these novel innovations are concerned with sensing, adaptation, actuation, and control. To integrate functions into such systems, devices, and structures, they require a design and development philosophy that is inherently interdisciplinary. The smart revolution has changed and will continue to change the semiconductor electronic industry and the many applications of such devices in industry, health care, and scientific research. The Handbook of Smart Systems and Materials is a one-stop comprehensive reference for designers and researchers of smart systems, smart materials, structures, and devices in universities, government laboratories, and industry. The systems and applications orientation makes this a forward-looking handbook that unifies a diverse range of current research areas related to smart systems. The book provides a general review of the fundamental concepts and future prospects of the various topics covered by MEMS, smart materials, and structures. Each chapter includes extensive references to the current professional literature.

Table of Contents:
MATERIALS SMART MATERIALS Introduction and General Discussion Piezoceramics Piezopolymers Ceramic Fabrication Polymer Synthesis Thin Film Deposition Sputtering, Spin Coating and E-Beam Ferroelectric Materials Suitable for Smart Structures, MEMS and Smart Electronics Ceramic Composites Relaxor Ferroelectrics Electrostrictive and Magnetostrictive Materials SHAPE MEMORY ALLOYS Introduction Materials Mechanical Behaviors Fabrication Thermodynamics Modeling ELECTRORHEOLOGICAL (ER) & MAGNETORHEOLOGICAL (MR) FLUIDS Introduction and General Disussion Materials for ER Fluids Dielectric Properties Electrostatic and Conduction Model Rotary Electrorheological Effect MR Fluids with Nano-Sized Particles Finite Element Analysis of ER Fluids Mechanism for Actuation Commercial MR Fluid Devices and ER Automotive Semi-Active Suspension System ELECTROACTIVE ION CONTAINING POLYMERS BIOMATERIALS EMERGING TECHNOLOGIES SENSORS & ACTUATORS SENSORS Sensors: pressure, chemical, magnetic, rate and flow sensors Accelerometers, gyroscopes Test structures for MEMS Biological sensors Fiber optic sensors, MOEMS MEMS: MATERIAL PROCESSING AND DEVICE FABRICATION Low stress films Lithography Optical, e-beam, ion beam, x-ray High depth of focus, topography Ion Implantation Etching; isotropic and non-isotropic processes INTEGRATED PROCESSES Bulk silicon micromachining Surface micromachining, sacrificial layer technology High-Aspect Ratio micromachining CVD oxide process LOCOS process LIGA processing PHOTOSENSITIVE PROCESSING OF MULTIFUNCTIONAL POLYMERS Photolithography Stereo Lithography 2D and 3D Fabrication of MEMS Microstructures Batch Fabrication of Silicon based micro components and devices Examples: Microgears, micro wheels, micro coil spring, micro pipes, microvenous valves, etc. Batch Fabrication of Micromotor and Multi-level Linkages Micro Photoforming Process and Micro Bonding Examples of Combined Architecture - Micro Clamping Tool, Endoscope and other Biomedical Devices, etc. INTEGRATED MEMS Integration of MEMS and Electronics Flip-chip integration Microelectronics-first approach Micromechanics-first approach Micromechanical springs, bearings, gears and connector Microvalves, micropumps and micromotors ACTUATORS Ferroelectrics Rare earth material actuators SMA EAP, muscle, cells ER and MR MEMS based actuators INTEGRATED PHOTONICS, OPTOELECTRONICS AND MEMS EMERGING TECHNOLOGIES MODELING METHOLOGIES AND CONTROL STRATEGIES FINITE ELEMENT MODELING Basic concepts of finite element modeling, 2-D and 3-D mesh generation Finite Element Modeling of sensors and actuators Finite Element Modeling of microelectromechanical structures CAD framework for the design of integrated microsystems Analysis and simulation using SPICE Listing of commercially available finite element packages and illustration of the usage of them for simple examples ANALYTICAL METHODS. Infinite Horizon Constrained model predictive control Data-based models Control strategies Overview of control techniques Closed loop techniques Emerging technologies INTEGRATION AND PACKAGING MICROELECTRONICS Field-effect transistor JFET MOSFET PMOS, NMOS, CMOS Chips for the memory Microprocessor Microwave of the future ASIC software and design MICROELECTRONIC COMPONENTS AND POWER SUPPLIES Electronic Microrelays Microelectromechanical Filters for Signal Processing Micro-Opto-Electric Transformer Solar Cell with MEMS Devices Rechargeable Microbatteries REMOTE WIRELESS COMMUNICATION SYSTEMS BETWEEN SENSORS AND ACTUATORS Cellular phones Communication antennas and systems Smart skin antenna Wireless telemetry, trnaceivers and transponders, GPS Data acquisition PACKAGING Electronic integration Semiconductor packaging applied to sensors Ceramic packaging Multichip modules Dual-chip packaging Surface-mount packaging Flip-chip Wafer-level; packaging Organic packaging EMERGING TECHNOLOGIES APPLICATIONS SMART STRUCTURES, SYSTEMS AND DEVICES Aerospace Space structures Automotive Automotive Civil Building control - active vibration control, structural dynamics Industrial processing and manufacturing Environmental EMERGING TECHNOLOGIES APPENDIX: Manufacturers, vendors contact details


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Product Details
  • ISBN-13: 9781482268492
  • Publisher: Taylor & Francis Ltd
  • Publisher Imprint: CRC Press
  • Language: English
  • No of Pages: 446
  • ISBN-10: 1482268493
  • Publisher Date: 26 Jun 2009
  • Binding: Digital (delivered electronically)
  • No of Pages: 446


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