Buy Evaluation of Advanced Semiconductor Materials by Electron Microscopy
close menu
Bookswagon
search
My Account
Home > Medicine: general issues > Medical equipment and techniques > Medical research > Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)
Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)

Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)


     0     
5
4
3
2
1



Available


X
About the Book

The last few years have ~een rapid improvements in semiconductor growth techniques which have produced an expanding range of high quality heterostructures for new semiconductor devises. As the dimensions of such structures approach the nanometer level, it becomes increasingly important to characterise materials properties such as composition uniformity, strain, interface sharpness and roughness and the nature of defects, as well as their influence on electrical and optical properties. Much of this information is being obtained by electron microscopy and this is also an area of rapid progress. There have been advances for thin film studies across a wide range of techniques, including, for example, convergent beam electron diffraction, X-ray and electron energy loss microanalysis and high spatial resolution cathodoluminescence as well as by conventional and high resolution methods. Important develop­ ments have also occurred in the study of surfaces and film growth phenomena by both microscopy and diffraction techniques. With these developments in mind, an application was made to the NATO Science Committee in late summer 1987 to fund an Advanced Research Work­ shop to review the electron microscopy of advanced semiconductors. This was subsequently accepted for the 1988 programme and became the "NATO Advanced Research Workshop on the Evaluation of Advanced Semiconductor Materials by Electron Microscopy". The Workshop took place in the pleasant and intimate surroundings of Wills Hall, Bristol, UK, during the week 11-17 September 1988 and was attended by fifty-five participants from fourteen countries.

Table of Contents:
High Resolution Electron Microscopy.- HREM of Edge-on Interfaces and Defects.- Image Processing Applied to HRTEM Images of Interfaces.- II-VI Semiconductor Interfaces.- High Resolution Electron Microscopy Study of Indium Distribution in InAs/GaAs Multilayers.- Convergent Beam Electron Diffraction.- Convergent Beam Electron Diffraction Studies of Defects, Strains and Composition Profiles in Semiconductors.- HOLZ Diffraction from Semiconductor Superlattices.- Determination of Composition and Ionicity by Critical Voltage and Other Electron Diffraction Methods.- Measurement of Structure-Factor Phases by Electron Diffraction for the Study of Bonding in Non-Centrosymmetric Semiconductors.- X-ray and Electron Energy Loss Microanalysis.- EDX and EELS Studies of Segregation in STEM.- Cathodoluminescence and Electron Beam Induced Conductivity.- TEM-Cathodoluminescence Study of Single and Multiple Quantum Wells of MBE Grown GaAs/AlGaAs.- EBIC Studies of Individual Defects in Lightly Doped Semiconductors CdTe as an Example.- Schottky Barriers.- Electronic Structure and Fermi Level Pinning Obtained with Spatially Resolved Electron Energy Loss Scattering.- Epitaxial NiSi2 and CoSi2 Interfaces.- Further Analysis of Interfaces.- The Fresnel Method for the Characterisation of Interfaces.- Strains and Misfit Dislocations at Interfaces.- Ordering/decomposition/analysis of local strains.- TEM and STEM Observations of Composition Variations in III-V Semiconductors.- Transmission Electron Microscopy and Transmission Electron Diffraction Studies of Atomic Ordering in Group III-V Compound Semiconductor Alloys.- Elastic Relaxation and TEM Image Contrasts in Thin Composition-Modulated Semiconductor Crystals.- Surface Microscopy and Diffraction.- Surface and Thin Film Growth Studied by ReflectionHigh Energy Electron Diffraction.- Low Energy Electron Microscopy (LEEM) and Photoemission Microscopy (PEEM) of Semiconductor Surfaces.- Transmission Electron Microscopy of In-Situ Deposited Films on Silicon.- Surface Studies by SEM and STEM.- Transmission and Reflection Electron Microscopy on Cleaved Edges of III-V Multilayered Structures.- Defects in Heteroepitaxy.- Dislocation Generation and Elimination in GaAs on Si.- The Microstructure of GaAs/Si Films Studied as a Function of Heat Treatment.- Electron Microscopy of Gex Sil-x/Si Strained Layer Superlattices.- Defect Structure in Low and High Misfit Systems.- In-Situ Electron Microscope Studies of Misfit Dislocation Introduction into Gex Sil-x/Si Heterostructures.- Misfit Dislocations in Inx Gal-x As/GaAs Heterostructures near the Critical Thickness.- Summary of Discussion on Instrumental Requirements for the Evaluation of Advanced Semiconductors by Electron Microscopy.

Review :
From Book News, Inc. These proceedings comprise papers reviewing technical progress as well as applications in the areas of: electron microscopy; electron diffraction; energy loss microanalysis; cathodoluminescence; Schottky Barriers; interfaces; analysis of local strains; surface microscopy; and defects in heteroepitaxy. Annotation copyright Book News, Inc. Portland, Or.


Best Sellers


Product Details
  • ISBN-13: 9781461278504
  • Publisher: Springer-Verlag New York Inc.
  • Publisher Imprint: Springer-Verlag New York Inc.
  • Height: 244 mm
  • No of Pages: 412
  • Returnable: N
  • Width: 170 mm
  • ISBN-10: 1461278503
  • Publisher Date: 13 Oct 2011
  • Binding: Paperback
  • Language: English
  • Returnable: N
  • Series Title: 203 NATO Science Series B:


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)
Springer-Verlag New York Inc. -
Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

Evaluation of Advanced Semiconductor Materials by Electron Microscopy: (203 NATO Science Series B:)

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    Fresh on the Shelf


    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!
    Your IP: 216.73.216.196 IN