Substrate Noise Coupling in Mixed-Signal ASICs
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Substrate Noise Coupling in Mixed-Signal ASICs

Substrate Noise Coupling in Mixed-Signal ASICs


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About the Book

The purpose of Substrate Noise Coupling in Mixed-Signal ASICs is to provide an overview of very recent research results in the field of substrate noise analysis and reduction techniques. Much of the reported work has been established as part of the Mixed-Signal Initiative of the European Union. It is a representative sampling of the current state of the art in this area. All the different aspects of the substrate noise coupling problem are covered. Some chapters describe techniques to model and reduce the digital switching noise injected in the substrate. Other chapters describe methods to analyse the propagation of the noise from the source (the digital circuitry) to the reception point (the embedded analog circuitry) through the substrate considered as a resistive/capacitive mesh. Finally, the remaining chapters describe techniques to model and especially to reduce the impact of substrate noise on the analog side. This is illustrated with several practical design examples and measurement results.

Table of Contents:
Technology Impact on Substrate Noise.- Substrate Noise Generation in Complex Digital Systems.- Modeling and Analysis of Substrate Noise Coupling in Mixed-Signal ICs.- SPACE for Substrate Resistance Extraction.- Models and Parameters for Crosstalk Simulation.- High-Level Simulation of Substrate Noise Generation in Complex Digitlal Systems.- Modeling the Impact of Digital Substrate Noise on Analog Integrated Circuits.- Measuring and Modeling the Effects of Substrate Noise on the LNA for a CMOS GPS Receiver.- A Practical Approach to Modeling Silicon-Crosstalk in Systems-on-Silicon.- The Reduction of Switching Noise Using CMOS Current Steering Logic.- Low-Noise Digital Design Techniques.- How to Deal with Substrate Bounce in Analog Circuits in Epi-Type CMOS Technology.- Reducing Substrate Bounce in CMOS RF-Circuitry.

Review :
From the reviews: "This book covers modeling and simulation for the noise from substrate. This book reviews the causes of noise in substrate and possible prevention of the noise. … As a practicing engineer, I feel that their techniques for noise prevention are legitimate and applicable. This book is worthwhile for IC design engineers. Those engineers that work on integration of analog and digital parts may want to read this book to prevent any malfunctioning ICs." (IEEE Circuits & Devices Magazine, Vol. 20 (5), September/October, 2004)


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Product Details
  • ISBN-13: 9781441953414
  • Publisher: Springer-Verlag New York Inc.
  • Publisher Imprint: Springer-Verlag New York Inc.
  • Height: 235 mm
  • No of Pages: 287
  • Returnable: Y
  • ISBN-10: 1441953418
  • Publisher Date: 07 Dec 2010
  • Binding: Paperback
  • Language: English
  • Returnable: Y
  • Width: 155 mm


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