IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials
Home > Science, Technology & Agriculture > Mechanical engineering and materials > Materials science > Engineering: Mechanics of solids > IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)
IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)

IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)


     0     
5
4
3
2
1



International Edition


X
About the Book

The papers in this proceeding are a collection of the works presented at the IUTAM symposium-Marrakech 2002 (October 20-25) which brought together scientists from various countries. These papers cover contemporary topics in multiscale modeling and characterization of materials behavior of engineering materials. They were selected to focus on topics related to deformation and failure in metals, alloys, intermetallics and polymers including: experimental techniques, deformation and failure mechanisms, dislocation-based modelling, microscopic-macroscopic averaging schemes, application to forming processes and to phase transformation, localization and failure phenomena, and computational advances. Key areas that are covered by some of the papers include modeling of material deformation at various scales. At the atomistic scale, results from MD simulations pertaining to deformation mechanisms in nano-crystalline materials as well as dislocation-defect interactions are presented. Advances in modeling of deformation in metals using discrete dislocation analyses are also presented, providing an insight into this emerging scientific technique that can be used to model deformation at the microscale. These papers address current engineering problems, including deformation of thin fIlms, dislocation behavior and strength during nanoindentation, strength in metal matrix composites, dislocation-crack interaction, development of textures in polycrystals, and problems involving twining and shape memory behavior. On Behalf of the organizing committee, I would like to thank Professor P.

Table of Contents:
New developments in the brittle to ductile transitions of fracture in intrinsically brittle crystals and polycrystals.- Dislocation-based length-scales in crystal plasticity: experiments and modeling.- Application of a variational self-consistent procedure to the prediction of deformation textures in polycrystals.- What about the yield transformation surface determination (austenite ? martensite) with the measurement of austenite and martensite lattice parameters for some shape memory alloys?.- Micro to macroscopic deformation behavior of amorphous polymer with slightly heterogeneous distribution of molecular chains.- Cross slip viewed at the nano — and micrometer scale.- A multiscale micromechanics approach to describe environmental effects on surface crack initiation under cyclic loading.- Atomic — scale modeling of dislocation behaviour under stress.- Coalescence and evolution of nanoscale islands during polycrystalline thin film growth.- On pic band propagation velocity under stress controlled tests in aluminium alloys.- Effect of some parameters on the elastoplastic behavior of green sand.- Experimental investigations of size effects in thin copper foils.- Plastic response of thin films due to thermal cycling.- Measurement of the stress intensity factor, kl, for copper by a digital image correlation method.- Homogeneization of viscoplastic materials.- Collective dislocation behavior in single crystalline aluminum under indentation.- Multiscale modeling of texture gradient effects on localization in fee polycrystals.- Multiaxial plastic fatigue behavior with multiscale modeling.- Damage, opening and sliding of grain boundaries.- Gradients of hardening in nonlocal dislocation based plasticity.- Determination of the material intrinsic length scale of gradientplasticity theory.- Computer simulation of contact force distribution in random granular packings.- Three — dimensional structures of the geometrically necessary dislocations generated from non — uniformities in metal microstructures.- Simulation of texture evolution in equal channel angular extrusion of copper using a new flow field.- Initial energy dissipation mechanism at crack tip on the ductile to brittle transition.- Constitutive modeling of viscoelastic unloading of glassy polymers.- On the constitutive theories of power — law materials containing voids.- Objective quantification of the ductility within the coupling elasticity — damage behavior: formulation.- Discrete dislocation predictions for single crystal hardening tension vs bending.- On plasticity and damage evolution during sheet metal forming.- Modeling of thermo-electro-elastic effective behaviors of piezoelectric composite mediums and analysis of reinforcement orientation effects.- Investigations in size dependent torsions and fractures.- Influence of microstructural parameters on shape memory alloys behavior.- Investigation of ridging in ferritic stainless steel using crystal plasticity finite element method.- Grain boundary effects and failure evolution in polycrystalline materials.- The influence of an heterogeneous dispersion on the failure behaviour of metal-matrix composites: micromechanical approach.- A cohesive segments approach for dynamic crack growth.- A linear model of processing path in cubic-orthotropic system.- Taylor theory with microscopic slip transfer conditions.- Dynamics of nanostructure formation during thin film deposition.- Prediction of damage in randomly oriented short-fibre composites by means of a mechanistic approach.- Nonsteady plain — strain ideal plastic flowconsidering elastic dead zone.- Multiscale modeling of non — linear behaviour of heterogeneous materials: comparison of recent homogénéisation methods.- Thermomechanical behaviour of shape memory alloy taylor’s model.- Multiscale analysis of dynamic deformation in monocrystals.- Micro/meso-modeling of polymeric composites with damage evolution.- An alternative approach for heterogeneous material behaviour modeling.- On anisotropic formulations of the elastic law within multiplicative inelasticity.- Deep drawing process of the aisi 304 stainless steel cup: interaction between design tools and kinetic of plastic strain induced martensite.- Modeling and simulation of dynamic plasticity and failure in ductile metals.- Effects of polymeric additives on the morphology and the structure of the calcium carbonate material.


Best Sellers


Product Details
  • ISBN-13: 9781402018619
  • Publisher: Springer-Verlag New York Inc.
  • Publisher Imprint: Springer-Verlag New York Inc.
  • Height: 235 mm
  • No of Pages: 434
  • Returnable: Y
  • Sub Title: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002
  • ISBN-10: 1402018614
  • Publisher Date: 31 Mar 2004
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Series Title: 114 Solid Mechanics and Its Applications
  • Width: 155 mm


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)
Springer-Verlag New York Inc. -
IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials: Proceedings of the IUTAM Symposium held in Marrakech, Morocco, 20–25 October 2002(114 Solid Mechanics and Its Applications)

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    New Arrivals


    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!