New research and applications in electro-magnetic compatibility and noise reduction
The new edition of Electromagnetic Compatibility Engineering reflects the most recent developments in the field of electro-magnetic compatibility (EMC) and noise reduction, covering practical applications in the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. The book discusses full-wave simulation techniques, how they work, and their strengths and weaknesses, and examines high-speed differential signals and the common-mode noise creation from these signals.
Updating core information on cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD, this new edition also discusses increased data rates and information on basic signal integrity.
Discover information on:
- What simulation tools can and cannot do, the finite element technique, and the partial element equivalent circuit technique
- Common mode noise from high speed differential signals, covering common node noise creation from in-pair skew, amplitude mismatch, and rise-fall time mismatch
- How to mitigate common mode noise through electromagnetic band gap (EBH) structures and transmission line grading
- The importance of slew rate, and difference between slew rate and signal rise time for real and test signals
- How to calculate the inductance associated with connecting decoupling capacitors
This new edition of Electromagnetic Compatibility Engineering is an excellent learning resource for graduate students in electromagnetic programs of study, and holds value for professionals in related fields seeking the latest cutting-edge research.
Table of Contents:
About the Editors xviii
About the Contributor xx
Preface xxi
Acknowledgments xxiii
About the Companion Website xxiv
1 Electromagnetic Compatibility 1
1.1 Introduction 1
1.2 Noise and Interference 1
1.3 Designing for Electromagnetic Compatibility 2
1.4 Engineering Documentation and EMC 3
1.5 The Regulatory Process 3
1.6 Typical Noise Path 4
1.7 Methods of Noise Coupling 5
1.8 Miscellaneous Noise Sources 7
1.9 Use of Network Theory 9
1.10 Summary 11
2 Digital Circuit Grounding 15
2.1 Frequency Versus Time Domain 16
2.2 Analog Versus Digital Circuits 17
2.3 Digital Logic Noise 17
2.4 Internal Noise Sources 18
2.5 Digital Circuit Ground-Return Noise 21
2.6 Ground-Return Plane Current Distribution and Impedance 27
2.7 Digital Logic Current Flow 44
2.8 Summary 50
3 Signal Integrity for Good EMC 54
3.1 Signal Integrity Parameters 54
3.2 Design Techniques 63
3.3 Effects of Signaling Methods 70
3.4 Summary 73
4 PCB Power Distribution Network Decoupling 75
4.1 Introduction 75
4.2 PDN Physics for PCB Power Delivery—Current Path, Circuit Model, and PDN Impedance 82
4.3 Inductance Concepts for Multilayer PCB Power Distribution Networks 90
4.4 Capacitors and Interconnects for PCB Power Distribution Networks 96
4.5 Achieving a PCB Target Impedance by Design 101
4.6 PCB PDN Impedance Measurements 107
5 PCB Layout and Stackup 114
5.1 General PCB Layout Considerations 114
5.2 PCB-to-Chassis Ground Connection 116
5.3 Return Path Discontinuities 117
5.4 PCB Layer Stackup 125
5.5 Summary 142
6 Passive Components 146
6.1 Capacitors 146
6.2 Inductors 152
6.3 Transformers 154
6.4 Resistors 155
6.5 Conductors 158
6.6 Transmission Lines 162
6.7 Ferrites 170
6.8 Summary 177
7 Balancing and Filtering 181
7.1 Balancing 181
7.2 Filtering 194
7.3 Power Supply Decoupling 198
7.4 Driving Capacitive Loads 204
7.5 System Bandwidth 207
7.6 Modulation and Coding 207
7.7 Summary 208
8 Cabling 211
8.1 Capacitive Coupling 212
8.2 Effect of Shield on Capacitive Coupling 214
8.3 Inductive Coupling 217
8.4 Mutual Inductance Calculations 219
8.5 Effect of Shield on Magnetic Coupling 221
8.6 Shielding to Prevent Magnetic Radiation 227
8.7 Shielding a Receptor Against Magnetic Fields 229
8.8 Common Impedance Shield Coupling 230
8.9 Experimental Data 231
8.10 Example of Selective Shielding 234
8.11 Shield Transfer Impedance 235
8.12 Coaxial Cable Versus Twisted Pair 235
8.13 Shielded Parallel Pair Cables 238
8.14 Braided Shields 239
8.15 Spiral Shields 241
8.16 Shield Terminations 244
8.17 Ribbon Cables 252
8.18 Electrically Long Cables 253
8.19 Summary 254
9 Modeling and Simulation 262
9.1 Introduction 262
9.2 The Finite-Difference Time-Domain Simulation Technique 262
9.3 The Method of Moments Modeling Technique 267
9.4 Finite Element Method 270
9.5 Simulation Validation 272
9.6 Summary 273
10 Shielding 275
10.1 Near Fields and Far Fields 275
10.2 Characteristic and Wave Impedances 278
10.3 Shielding Effectiveness 279
10.4 Absorption Loss 281
10.5 Reflection Loss 285
10.6 Composite Absorption and Reflection Loss 292
10.7 Summary of Shielding Equations 293
10.8 Shielding with Magnetic Materials 295
10.9 Experimental Data 297
10.10 Apertures 299
10.11 Waveguide Below Cutoff 310
10.12 Conductive Gaskets 312
10.13 The "Ideal" Shield 316
10.14 Conductive Windows 316
10.15 Conductive Coatings 317
10.16 Internal Shields 320
10.17 Cavity Resonance 322
10.18 Grounding of Shields 322
10.19 Summary 323
11 Grounding 327
11.1 AC Power Distribution and Safety Grounds 328
11.2 Signal Grounds 338
11.3 Equipment/System Grounding 348
11.4 Ground Loops 358
11.5 Low-Frequency Analysis of Common-Mode Choke 361
11.6 High-Frequency Analysis of Common-Mode Choke 365
11.7 Single Ground Reference for a Circuit 366
11.8 Summary 367
12 Digital Circuit Radiation 371
12.1 Differential Mode Radiation 371
12.2 Controlling Differential Mode Radiation 377
12.3 Common Mode Radiation 381
12.4 Controlling Common-Mode Radiation 385
13 Conducted Emissions 394
13.1 Power-Line Impedance 394
13.2 Switched-Mode Power Supplies 397
13.3 Power-Line Filters 409
13.4 Primary-to-Secondary Common-Mode Coupling 417
13.5 Frequency Dithering 419
13.6 Power Supply Instability 419
13.7 Magnetic Field Emissions 420
13.8 Variable Speed Motor Drives 422
13.9 Harmonic Suppression 427
13.10 Summary 430
14 RF and Transient Immunity 434
14.1 Performance Criteria 434
14.2 RF Immunity 435
14.3 Transient Immunity 446
14.4 Power-Line Disturbances 458
14.5 Summary 461
15 Electrostatic Discharge 465
15.1 Static Generation 465
15.2 Human Body Model 470
15.3 Static Discharge 473
15.4 ESD Protection in Equipment Design 474
15.5 Preventing ESD Entry 477
15.6 Hardening Sensitive Circuits 488
15.7 ESD Grounding 488
15.8 Non-Grounded Products 489
15.9 Field-Induced Upset 490
15.10 Transient Hardened Software Design 491
15.11 Time Windows 494
15.12 Summary 495
16 Mixed-Signal PCB Layout 499
16.1 Split Ground Planes 499
16.2 Microstrip Ground Plane Current Distribution 500
16.3 Analog and Digital Ground Pins 503
16.4 When Should Split Ground-Return Planes Be Used? 506
16.5 Mixed Signal ICs 507
16.6 High-Resolution A/D and D/A Converters 509
16.7 A/D and D/A Converter Support Circuitry 512
16.8 Vertical Isolation 515
16.9 Mixed-Signal Power Distribution 517
16.10 The IPC Problem 519
16.11 Summary 520
17 Precompliance EMC Measurements 523
17.1 Test Environment 523
17.2 Antennas Versus Probes 524
17.3 Common-Mode Currents on Cables 524
17.4 Near-Field Measurements 527
17.5 Noise Voltage Measurements 531
17.6 Conducted Emission Testing 533
17.7 Spectrum Analyzers 539
17.8 EMC Crash Cart 542
17.9 One-Meter Radiated Emission Measurements 543
17.10 Precompliance Immunity Testing 547
17.11 Precompliance Power Quality Tests 552
17.12 Margin 555
17.13 Summary 556
Problems 557
References 558
Further Reading 559
Index 560
About the Author :
BRUCE R. ARCHAMBEAULT is an IEEE Fellow, an IBM Distinguished Engineer Emeritus, and an Adjunct Professor at Missouri University of Science and Technology. He received his PhD from the University of New Hampshire in 1997. His doctoral research focused on computational electromagnetics applied to real-world EMC problems.
JAMES L. DREWNIAK received BS (highest honors), MS, and PhD degrees from the University of Illinois at Urbana-Champaign. He is a Curator's Professor Emeritus at the Missouri University of Science and Technology. He continues to work as a faculty member in the Missouri S&T EMC Laboratory, as well as consult and provide short courses in industry. He is an IEEE Fellow.
JOSEPH (JAY) DIEPENBROCK holds electrical engineering degrees from Brown University and Syracuse University and has expertise in IC, analog/RF, backplane, cable, and connector design and testing. A contributor to EIA-364, PCI Express, InfiniBand, and IEEE 370, he is currently an RF and signal integrity consultant with Northrop Grumman Corp. and SIRF Consultants, LLC.
