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Home > Society and Social Sciences > Politics and government > Development of New Low-Cost, High-Performance, Pv Module Encapsulant/Packaging Materials: Annual Technical Progress Report
Development of New Low-Cost, High-Performance, Pv Module Encapsulant/Packaging Materials: Annual Technical Progress Report

Development of New Low-Cost, High-Performance, Pv Module Encapsulant/Packaging Materials: Annual Technical Progress Report


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About the Book

The primary objectives of this subcontract are for Specialized Technology Resources, Inc., to work with U.S.-based PV module manufacturers representing crystalline silicon, polycrystalline silicon, amorphous silicon, copper indium diselenide (CIS), and other state-of-the-art thin-film technologies to develop formulations, production processes, prototype and qualify new low-cost, high-performance photovoltaic module encapsulants/packaging materials. The manufacturers will assist in identifying each materials' deficiencies while undergoing development, and then ultimately in qualifying the final optimized materials designed to specifically meet their requirements. Upon completion of this program, new low-cost, high-performance, PV module encapsulant/packaging materials will be qualified, by one or more end-users, for their specific application. Information gathering on topics related to thin-film module technology, including device performance/failure analysis, glass stability, and device encapsulation, has been completed. This information has provided concepts and considerations for module failure analysis, accelerated testing design, and encapsulation formulation strategy for thin-film modules.


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Product Details
  • ISBN-13: 9781249137696
  • Publisher: Bibliogov
  • Publisher Imprint: Bibliogov
  • Height: 246 mm
  • Sub Title: Annual Technical Progress Report
  • Width: 189 mm
  • ISBN-10: 1249137691
  • Publisher Date: 01 Jul 2012
  • Binding: Paperback
  • Spine Width: 2 mm
  • Weight: 82 gr


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Development of New Low-Cost, High-Performance, Pv Module Encapsulant/Packaging Materials: Annual Technical Progress Report
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