About the Book
Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Pages: 48. Chapters: Chip carriers, Dual in-line package, Surface-mount technology, Flip chip, Electronic packaging, Package on package, Quad Flat No leads package, Ball grid array, Nemotek Technologie, Small-outline integrated circuit, Integrated circuit packaging, AlSiC, Embedded Wafer Level Ball Grid Array, Dymalloy, Copper-tungsten, TO-220, UICC, Multi-leaded power package, Land grid array, E-Material, Quad Flat Package, TO-92, TO-3, Multi-chip module, Through-hole technology, Plastic leaded chip carrier, Thin small-outline package, Pin grid array, Zig-zag in-line package, DO-204, Chip scale package, Micro-FCBGA, TO-18, Shrink Small-Outline Package, TSSOP, Single in-line package, MELF electronic components, DO-41, Wafer-level Packaging, MicroLeadFrame, Flip-chip pin grid array, Low insertion force, List of chip carriers, Quadruple in-line package, Thin Quad Flat Pack, Flatpack, Die attachment, Stud grid array, Organic pin grid array, Wafer-level optics, Staggered pin grid array, Ceramic pin grid array, Semiconductor package, Integrated circuit encapsulation, Micro Leadframe Package, Area array package, Leadless chip carrier, Low-profile Quad Flat Package, D2PAK, HVQFN, Plastic quad flat pack, BGA2, Cerquad, Mini-Cartridge, BGA1, DO-35. Excerpt: Surface mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface mount device or SMD. In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads...
