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Home > Art, Film & Photography > Centaur-Prozessor: Idt Winchip, Via C3, Via Nano, Via C7, Via Eden, Via Corefusion, Via Cyrix III, Via-Isaiah-Mikroarchitektur
Centaur-Prozessor: Idt Winchip, Via C3, Via Nano, Via C7, Via Eden, Via Corefusion, Via Cyrix III, Via-Isaiah-Mikroarchitektur

Centaur-Prozessor: Idt Winchip, Via C3, Via Nano, Via C7, Via Eden, Via Corefusion, Via Cyrix III, Via-Isaiah-Mikroarchitektur


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About the Book

Aus Wikipedia. Nicht dargestellt. Auszug: The VIA C3 is a family of x86 central processing units for personal computers designed by Centaur Technology and sold by VIA Technologies. The different CPU cores are built following the design methodology of Centaur Technology. VIA Cyrix III was renamed VIA C3 with the switch to the advanced "Samuel 2" (C5B) core. The addition of an on-die L2 cache improved performance somewhat. As it was not built upon Cyrix technology at all, the new name was just a logical step. To improve power consumption and reduce manufacturing costs, Samuel 2 was produced with 150 nm process technology. The VIA C3 processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only new revisions of the "Samuel 2" core with some minor modifications to the bus protocol of "Ezra-T" to match compatibility with Intel's Pentium III "Tualatin" cores. VIA enjoyed the lowest power usage in the x86 CPU market for several years. Performance, however, fell behind due to the lack of improvements to the design. Uniquely, the retail C3 CPU shipped inside a metal package. The "Nehemiah" (C5XL) was a major core revision. At the time, VIA's marketing efforts did not fully reflect the changes that had taken place. The company addressed numerous design shortcomings of the older cores, including incomplete MMX compatibility and the half-speed FPU. The number of pipeline stages was increased from 12 to 16, to allow for continued increases in clock speed. Additionally, it implemented support for the cmov instruction, making it a 686-class processor. The Linux kernel refers to this core as the C3-2. It also removes 3DNow! instructions in favour of implementing SSE. However, it was still based upon the aging Socket 370, running the single data rate front side bus at just 133 MHz. Because the embedded system marketplace prefers low-power, low-c...http: //booksllc.net/?l=d


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Product Details
  • ISBN-13: 9781158785926
  • Publisher: Books LLC
  • Publisher Imprint: Books LLC
  • Height: 152 mm
  • No of Pages: 44
  • Spine Width: 3 mm
  • Weight: 77 gr
  • ISBN-10: 1158785925
  • Publisher Date: 22 Jul 2010
  • Binding: Paperback
  • Language: English
  • Returnable: N
  • Sub Title: Idt Winchip, Via C3, Via Nano, Via C7, Via Eden, Via Corefusion, Via Cyrix III, Via-Isaiah-Mikroarchitektur
  • Width: 229 mm


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