About the Book
Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Pages: 116. Chapters: Printed circuit board, Wire wrap, Photoplotter, Point-to-point construction, Roll-to-roll processing, Joint Test Action Group, Soldering, Surface-mount technology, Radiation hardening, Thermal profiling, Adhesive bonding, Flexible circuit, Conformal coating, Thermal copper pillar bump, Automated optical inspection, Direct bonding, Eutectic bonding, Anodic bonding, Test engineer, Glass frit bonding, Gerber format, Ledglass, Plasma activated bonding, LED Headliner, Thermocompression bonding, Reactive bonding, Reflow soldering, Boundary scan, Process Window Index, SMT placement equipment, Convia, Nemotek Technologie, Printed circuit board milling, Gold plating, Transparent LED embedded glass, Corelis, Mordant, In-circuit test, Low temperature co-fired ceramic, FR-4, Occam Process, Wafer bonding, Enterprise test software, Rework, DMSMS, Reflow oven, Depanel, Excellon Format, Flexible electronics, LEDFilm, Dip soldering, Selective soldering, Videoton, White box, Dichroic LEDGlass, Insertion mount machine, Through-hole technology, Turret board, 5DX, HASL, Capacitively coupled plasma, Serial Vector Format, Phototool, Refurbishment, Thick film technology, Boundary scan description language, Stretchable electronics, FR-2, Stamped Circuit Board, BEOL, Monoboard, Wafer-level Packaging, Potting, Tape-automated bonding, Netlist Inc., Speedwire, Pad cratering, Solder mask, Reference design, Switchcraft, FEOL, Heavy copper, Copper pour, Wafer-level optics, Electroless nickel immersion gold, Board to board connectors, Power-off testing, Footprint, Optical Radiation Corporation, IAg, Phenolic paper, Solder Mask Over Bare Copper, C.I.D.+, Organic Solderability Preservative, Board finger. Excerpt: Joint Test Action Group (JTAG) is the common name for what was later standardized as the IEEE 1149.1 Standard Test Access Port and Boundar...
