About the Book
Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Pages: 26. Chapters: Advanced Micro Devices sockets, Dual in-line package, Zero insertion force, Socket 7, CPU socket, Slot 1, LGA 775, Socket AM3, Socket G1, Socket AM2, LGA 1156, Socket 370, Socket AM2+, Socket 479, LGA 1366, Socket M, Socket 939, Socket 754, Socket F, Socket 478, Plastic leaded chip carrier, Super Socket 7, LGA 1155, Socket G34, Socket 940, Slot 2, Micro-FCBGA, Socket 604, Socket 603, Slotket, Socket C32, Socket S1, Socket 5, LGA 771, Socket 423, Slot A, Socket 8, LGA 2011, Socket 563, Socket P, LGA 1356, Socket 1, Socket 2, Socket F+, PAC418, Socket 495, PAC611, Socket FS1, Socket 441, Future CPU Port, LGA 1248, Micro-PGA2, LGA 1567. Excerpt: In microelectronics, a dual in-line package (DIP), sometimes called a DIL-package (for Dual In Line-package), is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board (PCB), i.e. to pass through holes on the PCB and be soldered on the other side. DIP is sometimes incorrectly considered to stand for dual in-line pin, in an effort to justify the redundant term "DIP package" (Dual in-line pin would imply one line of two pins). Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device(s), and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description (with bent leads at the sides.) A DIP is usually referred to as a DIPn, where n is the total number of pins. Fo...
