Direct Copper Interconnection for Advanced Semiconductor Technology
Home > Science, Technology & Agriculture > Electronics and communications engineering > Electronics engineering > Electronic devices and materials > Direct Copper Interconnection for Advanced Semiconductor Technology
Direct Copper Interconnection for Advanced Semiconductor Technology

Direct Copper Interconnection for Advanced Semiconductor Technology


     0     
5
4
3
2
1



Out of Stock


Notify me when this book is in stock
X
About the Book

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Table of Contents:
Chapter 1: Advanced Packaging Landscape for Heterogeneous Integration Chapter 2: Direct Copper Interconnection for Die/Wafer Bonding: Overview Chapter 3: Hybrid Bonding Process Technology Chapter 4: Materials for Hybrif Bonding Chapter 5: Copper Electrodeposition for Advanced Packaging and Hybrid Bonding Chapter 6: Planarization for Advanced Packaging and Hybrid Chapter 7: Permanent and Temporary Wafer Bonding Chapter 8:  Die-to-Wafer Hybrid Bonding for Direct Copper Intercon Chapter 9: Design for Hybrid Bonding and Chiplets Chapter 10: Thermal Modeling and Simulation for Advanced 3DIC Systems Chapter 11: Characterization, Modeling, and Reliability for Direct Copper Interconnection Chapter 12: Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration

About the Author :
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President for Technology & Engineering at Flex (formerly Flextronics), a global player for electronics design and manufacturing, and as Chief Marketing Officer at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics. Dr. Shangguan has published several books and authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents. He is an IEEE EPS Distinguished Lecturer, and has given numerous keynotes, seminars and lectures globally. Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers. Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. degree in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan is based in San Jose, California, and travels globally in service of the industry.


Best Sellers


Product Details
  • ISBN-13: 9781040028698
  • Publisher: Taylor & Francis Ltd
  • Publisher Imprint: CRC Press
  • Language: English
  • ISBN-10: 1040028691
  • Publisher Date: 28 Jun 2024
  • Binding: Digital (delivered electronically)


Similar Products

Add Photo
Add Photo

Customer Reviews

REVIEWS      0     
Click Here To Be The First to Review this Product
Direct Copper Interconnection for Advanced Semiconductor Technology
Taylor & Francis Ltd -
Direct Copper Interconnection for Advanced Semiconductor Technology
Writing guidlines
We want to publish your review, so please:
  • keep your review on the product. Review's that defame author's character will be rejected.
  • Keep your review focused on the product.
  • Avoid writing about customer service. contact us instead if you have issue requiring immediate attention.
  • Refrain from mentioning competitors or the specific price you paid for the product.
  • Do not include any personally identifiable information, such as full names.

Direct Copper Interconnection for Advanced Semiconductor Technology

Required fields are marked with *

Review Title*
Review
    Add Photo Add up to 6 photos
    Would you recommend this product to a friend?
    Tag this Book Read more
    Does your review contain spoilers?
    What type of reader best describes you?
    I agree to the terms & conditions
    You may receive emails regarding this submission. Any emails will include the ability to opt-out of future communications.

    CUSTOMER RATINGS AND REVIEWS AND QUESTIONS AND ANSWERS TERMS OF USE

    These Terms of Use govern your conduct associated with the Customer Ratings and Reviews and/or Questions and Answers service offered by Bookswagon (the "CRR Service").


    By submitting any content to Bookswagon, you guarantee that:
    • You are the sole author and owner of the intellectual property rights in the content;
    • All "moral rights" that you may have in such content have been voluntarily waived by you;
    • All content that you post is accurate;
    • You are at least 13 years old;
    • Use of the content you supply does not violate these Terms of Use and will not cause injury to any person or entity.
    You further agree that you may not submit any content:
    • That is known by you to be false, inaccurate or misleading;
    • That infringes any third party's copyright, patent, trademark, trade secret or other proprietary rights or rights of publicity or privacy;
    • That violates any law, statute, ordinance or regulation (including, but not limited to, those governing, consumer protection, unfair competition, anti-discrimination or false advertising);
    • That is, or may reasonably be considered to be, defamatory, libelous, hateful, racially or religiously biased or offensive, unlawfully threatening or unlawfully harassing to any individual, partnership or corporation;
    • For which you were compensated or granted any consideration by any unapproved third party;
    • That includes any information that references other websites, addresses, email addresses, contact information or phone numbers;
    • That contains any computer viruses, worms or other potentially damaging computer programs or files.
    You agree to indemnify and hold Bookswagon (and its officers, directors, agents, subsidiaries, joint ventures, employees and third-party service providers, including but not limited to Bazaarvoice, Inc.), harmless from all claims, demands, and damages (actual and consequential) of every kind and nature, known and unknown including reasonable attorneys' fees, arising out of a breach of your representations and warranties set forth above, or your violation of any law or the rights of a third party.


    For any content that you submit, you grant Bookswagon a perpetual, irrevocable, royalty-free, transferable right and license to use, copy, modify, delete in its entirety, adapt, publish, translate, create derivative works from and/or sell, transfer, and/or distribute such content and/or incorporate such content into any form, medium or technology throughout the world without compensation to you. Additionally,  Bookswagon may transfer or share any personal information that you submit with its third-party service providers, including but not limited to Bazaarvoice, Inc. in accordance with  Privacy Policy


    All content that you submit may be used at Bookswagon's sole discretion. Bookswagon reserves the right to change, condense, withhold publication, remove or delete any content on Bookswagon's website that Bookswagon deems, in its sole discretion, to violate the content guidelines or any other provision of these Terms of Use.  Bookswagon does not guarantee that you will have any recourse through Bookswagon to edit or delete any content you have submitted. Ratings and written comments are generally posted within two to four business days. However, Bookswagon reserves the right to remove or to refuse to post any submission to the extent authorized by law. You acknowledge that you, not Bookswagon, are responsible for the contents of your submission. None of the content that you submit shall be subject to any obligation of confidence on the part of Bookswagon, its agents, subsidiaries, affiliates, partners or third party service providers (including but not limited to Bazaarvoice, Inc.)and their respective directors, officers and employees.

    Accept

    New Arrivals


    Inspired by your browsing history


    Your review has been submitted!

    You've already reviewed this product!