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Electroplating and Electroless Plating of Copper and Its Alloys

Electroplating and Electroless Plating of Copper and Its Alloys


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About the Book

This volume serves as a comprehensive guide to copper plating technology. The contents have been written by a team of experts who cover all aspects of copper plating processes, including deposition and process details, process control, quality assurance, the properties of the deposited copper, and the effects of deposition parameters on properties. The volume also covers related technologies such as electroforming, patination (coloring) of copper, and the use of copper in electronics (for printed wiring boards and integrated circuits) and in the automotive industry. Includes a database with some 8000 abstracts covering all aspects of the surface treatment of copper and its alloys. Contents: Introduction to Copper and its Chemical and Physical Properties; Electrodeposition of Copper and Its Alloys: Principles and Processes; Technology of Copper Electrodeposition: types of Plating Baths and Bath Compositions; Properties of Copper and Copper Alloy Coatings; Applications of Electrodeposited Copper and Copper Alloys; Electroless Copper Coatings: Processes, Pretreatments, Applications; Properties of Electorless Copper Coatings; Quality Assurance, Analysis and Process Optimization in Copper Deposition; Stripping of Copper and Copper Alloy Coatings; Recycling and Effluent Treatment; Copper in Microtechnology; Copper in Printed Circuit Board Technology; Appendix: Copper Plating and Related Standards; Index.


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Product Details
  • ISBN-13: 9780904477269
  • Publisher: Finishing Publications Ltd
  • Publisher Imprint: Finishing Publications Ltd
  • Height: 230 mm
  • ISBN-10: 0904477266
  • Publisher Date: /01/2003
  • Binding: Paperback


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