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Rapid Thermal Processing and beyond: Applications in Semiconductor Processing: (Volumes 573-574 Materials Science Forum)

Rapid Thermal Processing and beyond: Applications in Semiconductor Processing: (Volumes 573-574 Materials Science Forum)


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About the Book

Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.This special-topic book, "Rapid Thermal Processing and Beyond: Applications in Semiconductor Processing" focuses on various aspects of Rapid Thermal and Millisecond Annealing and is arranged so as to follow the major processing steps involved in high-performance transistor fabrication, without claiming to be a complete catalogue of all of the Rapid Thermal Processing (RTP) steps currently in use.Starting with the silicon wafer-material itself and emphasizing various aspects of devices, from advanced gate dielectrics to source/drain engineering, the issue ends with a summary of fully silicided gates. Moreover, thermal processing development over the past 30 years is highlighted for full-wafer millisecond annealing, laser annealing and high-volume production RTP systems. The latest insights into surface cleaning for nano-technology as well as Secondary Ion Mass Spectrometry are also discussed. Experts from most of the leading semiconductor and equipment companies and research institutes contributed to this review of the latest rapid thermal processing innovations. This makes it truly a state-of-the-art compendium.

Table of Contents:
Dedication III Dedication 2 Dedication I Preface Chapter 1: Historical RTP Review The Expanding Role of Rapid Thermal Processing in CMOS Manufacturing Evolution of Commercial RTP Modules Chapter 2: Wafer Parameter Tuning and Defects Fast Diffusion in Germanium and Silicon Investigated by Lamp-Based Rapid Thermal Annealing Rapid Thermal Processing and the Control of Oxygen Precipitation Behaviour in Silicon Wafers High Temperature RTP Application in SOI Manufacturing Chapter 3: Surface Preparation and Gate Dielectrics Cleaning of Silicon Surfaces for Nanotechnology Heavy Water in Gate Stack Processing Advanced Gate Dielectric Development for VLSI Technology A Growth Kinetics Model for the Radical Oxidation of Silicon Investigation of Ultra Thin Thermal Nitrided Gate Dielectrics in Comparison to Plasma Nitrided Gate Dielectrics for High-Performance Logic Application for 65nm High-K: Latest Developments and Perspectives Production Worthy ALD in Batch Reactors Chapter 4: USJ Formation and Metrology Ultra Shallow Depth Profiling with SIMS Implant Annealing – An Evolution from Soak over Spike to Millisecond Annealing A Light-Induced Annealing of Silicon Implanted Layers Laser Annealing of Implanted Semiconductor Layers – One Bridge to Nano-Processing An Overview of ms Annealing for Deep Sub-Micron Activation Extended Defects Evolution in Pre-Amorphised Silicon after Millisecond Flash Anneals Modeling and Simulation of Advanced Annealing Processes Vacancy Engineering – An Ultra-Low Thermal Budget Method for High-Concentration 'Diffusionless' Implantation Doping Ultra-Shallow Junction Formation Using Rapid Thermal Processing Ultra-Rapid Thermal Process for ULSIs Advanced Millisecond Annealing Technologies and its Applications and Concerns on Advanced Logic LSI Fabrication Processes Doping Strategies for FinFETs Chapter 5: Advanced Silicides Formation RTP Requirements for CMOS Integration of Dual Work Function Phase Controlled Ni-FUSI (Fully Silicided) Gates with Simultaneous Silicidation of nMOS (NiSi) and pMOS (Ni-Rich Silicide) Gates on HfSiON Chapter 6: Pattern Effects A Short History of Pattern Effects in Thermal Processing Conduction Heating in RTP Fast, and Pattern-Independent Advanced Annealing Schemes for High-Performance SOI Logic Technologies Chapter 7: Temperature Measurement Model Based Measurement in Advanced Rapid Thermal Processing Chapter 8: Flash Annealing for ULSI and Beyond Si Short Time Thermal Processing: From Electronics via Photonics to Pipe Organs of the 17th Century


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Product Details
  • ISBN-13: 9780878493913
  • Publisher: Trans Tech Publications Ltd
  • Publisher Imprint: Trans Tech Publications Ltd
  • Height: 240 mm
  • No of Pages: 448
  • Spine Width: 22 mm
  • Width: 170 mm
  • ISBN-10: 0878493913
  • Publisher Date: 01 Apr 2008
  • Binding: Paperback
  • Language: English
  • Series Title: Volumes 573-574 Materials Science Forum
  • Weight: 1000 gr


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Rapid Thermal Processing and beyond: Applications in Semiconductor Processing: (Volumes 573-574 Materials Science Forum)
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