About the Book
The Handbook of Adhesive Technology, Second Edition exceeds the ambition of its bestselling forerunner by reexamining the mechanisms driving adhesion, categories of adhesives, techniques for bond formation and evaluation, and major industrial applications. Integrating modern technological innovations into adhesive preparation and application, this greatly expanded and updated edition comprises a total of 26 different adhesive groupings, including three new classes. The second edition features ten new chapters, a 40-page list of resources on adhesives, and abundant figures, tables, equations.
Table of Contents:
Review topics: historical development of adhesives and adhesive bonding, Fred A. Keimel; information resources, William F. Harrington. Fundamental aspects: theories and mechanisms of adhesion, J. Schultz and M. Nardin; the mechanical theory ofadhesion, D.E. Packham; acid-base interactions - relevance to adhesion and adhesive bonding, Mohamed M. Chehimi, Ammar Azioune and Eva Cabet-Deliry; interactions of polymers in solution with surfaces, Jean-Francois Joanny; tailoring adhesion of adhesiveformulations by molecular mechanics/dynamics, A. Pizzi; principles of polymer networking and gel theory in thermosetting adhesive formulations, A. Pizzi; application of plasma technology for improved adhesion materials, Om S. Kolluri; silane and otheradhesion promoters in adhesive technology, Peter Walker; testing of adhesives, K.L. DeVries and P.R. Borgmeier; the physical testing of pressure-sensitive adhesive systems, John Johnston; durability of adhesive joints, Guy D. Davis; analysis of adhesives,David N.-S. Hon; fracture of adhesive-bonded wood joints, Bryan H. River; fracture mechanics methods for interface bond evaluations of fibre-reinforced plastic/wood hybrid composites, Julio F. Davalos and Pizhong Qiao; spectroscopic techniques in adhesivebonding, W.J. van Ooij; ultraviolet stabilization of adhesives, Douglas Horsey; thermal stabilization of adhesives, Neal J. Earhart, Ambu Patel, and Gerrit Knobloch. Adhesive classes: protein adhesives for wood, Alan L. Lambuth; animal glues andadhesives, Charles L. Pearson; carbohydrate polymers as adhesives, Melissa G.D. Baumann and Anthony H. Conner; natural rubber-based adhesives, Sadhan K. De; elastomeric adhesives, William F. Harrington; polysulfide sealants and adhesives, Naim Akmal andA.M. Usmani; phenolic resin adhesives, A. Pizzi; natural phenolic adhesives I - Tannin, A. Pizzi; natural phenolic adhesives II - lignin, A. Pizzi; resorcinol adhesives, A. Pizzi; furan-based adhesives, Mohamed Naceur Belgacem and Alessandro Gandini;urea-formaldehyde adhesives, A. Pizzi; melamine-formaldehyde adhesives, A. Pizzi; isocyanate wood binders, Charles E. Frazier; polyurethane adhesives, Dennis G. Lay and Paul Cranley; polyvinyl and ethylene-vinyl acetates, Ken Geddes; unsaturated polyesteradhesives, A. Pizzi; hot-melt adhesives, A. Pizzi; reactive acrylic adhesives, Dennis J. Damico; anaerobic adhesives, Richard D. Rich; aerobic acrylics - increasing quality and productivity with customization and adhesive/process integration, Andrew G.Bachman; technology of cyanoacrylate adhesives for industrial assembly, William G. Repensek; silicone Adhesives and sealants, Loren D. Lower and Jerome M. Klosowski; epoxy resin adhesives, T.M. Goulding; pressure-sensitive adhesives, T.M. goulding;electrically conductive adhesives, Alan M. Lyons and D. W. Dahringer. Application of adhesives: adhesives in the electronics industry, Monika Bauer and Jurgen Schneider. (Part contents).
