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Home > Science, Technology & Agriculture > Electronics and communications engineering > Electronics engineering > Electronic devices and materials > Microscale Heat Conduction in Integrated Circuits and Their Constituent Films: (6 Microsystems)
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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films: (6 Microsystems)

Microscale Heat Conduction in Integrated Circuits and Their Constituent Films: (6 Microsystems)


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About the Book

The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermometry technique captures temperature fields with high temporal and spatial failures in devices that are subjected to electrical overstress (EOS) and electrostatic discharge (ESD). Also reported are techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Theoretical analysis on the data yields insight into the dependence of thermal properties on film processing conditions. The techniques and data presented here will greatly aid the thermal engineering of interconnects and transistors.

Table of Contents:
1 Introduction.- 1.1 Thermal Issues in Integrated Circuit Elements.- 1.2 Scope of Research.- 1.3 Book Overview.- 2 Review of Microscale Thermometry Techniques.- 2.1 Electrical Methods.- 2.2 Optical Methods.- 3 High Spatial and Temporal Resolution Thermometry.- 3.1 Thermoreflectance Thermometry Technique.- 3.2 Thermal Characterization of Silicon-on-Insulator High-Voltage Transistors.- 3.3 Thermal Characterization of Interconnects.- 4 Thermal Properties of Amorphous Dielectric Films.- 4.1 Thermal Characterization Techniques for Dielectric Films.- 4.2 Heat Transport in Amorphous Silicon Dioxide.- 5 Heat Conduction in Crystalline Silicon Films.- 5.1 Phonon Dispersion and its Implication on the Estimation of the Phonon Mean Free Path.- 5.2 Measurements of In-Plane Thermal Conductivities of Silicon Films.- 5.3 Heat Conduction in Semiconductors at High Temperatures.- 5.4 Prediction of the In-Plane Thermal Conductivity of Silicon Thin Films.- 5.5 Simplified Phonon Transport Equations Accounting for Phonon Dispersion.- 5.6 Hot Phonon Effects.- 6 Summary and Recommendations.- 6.1 Atomistic Simulations of Heat Transport.- 6.2 Thermal Conductivities of Nanostructures.- 6.3 Detailed Simulations of Semiconductor Device.- A Uncertainty Analysis.- A.1 Uncertainly in the Temperature Rise.- A.2 Uncertainly in the Thermal Properties of Dielectric Films.- A.3 Uncertainly in the In-Plane Thermal Conductivity of Thin Films.


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Product Details
  • ISBN-13: 9780792385912
  • Publisher: Kluwer Academic Publishers
  • Publisher Imprint: Kluwer Academic Publishers
  • Height: 235 mm
  • No of Pages: 102
  • Returnable: Y
  • Width: 155 mm
  • ISBN-10: 0792385918
  • Publisher Date: 31 Aug 1999
  • Binding: Hardback
  • Language: English
  • Returnable: Y
  • Series Title: 6 Microsystems


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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films: (6 Microsystems)
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