Hot Isostatic Processing by H.V. Atkinson at Bookstore UAE
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Hot Isostatic Processing

Hot Isostatic Processing


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About the Book

The aim of this book is to provide an introduction to the increasingly exploited technology of Hot Isostatic Pressing (HIPping). It is intended for two audiences. Firstly, the manufacturing or design engineer who may not have a materials science background, but who needs to develop an appreciation of the scope of the HIPping process. Secondly, the engineering or materials undergraduate who needs to understand how HIPping as a modern manufacturing method can offer potential improvements to material properties relative to more conventional techniques. In view of the breadth of potential readership the text is written as far as possible in such a way that technical terms are explained as the reader goes along. There is little mathematics and the focus is on discussing the principal issues. For the reader who wishes to pursue the subject a further reading section has been compiled. For the student, a number of worked examples are also provided. Most of the worked examples are accessible to anyone with a good grasp of A-level physics.

Table of Contents:
Part 1 Introduction: what is Hot Isostatic Pressing?; the distinction between isostatic and unidirectional pressing; how is a specified shape achieved with HIPping?; pressures and temperatures of HIPping; applications of HIPping; an example - HIPping to densify castings; the rapid increase in the use of HIPping. Part 2 Science of HIPping: origin of pores; pore closure during sintering. Part 3 Technology of HIPping: the pressure vessel; the furnace; pressurising gas; encapsulation; surface-connected porosity; furnace furniture; the HIPping cycle; control; quality assurance. Part 4 Castings: low cost castings; medium cost castings; high cost castings; effect of HIPping on welds. Part 5 Pre-sintered components: hardmetals; pre-sintered ceramics. Part 6 Tool steels; superalloy powders; ceramic powders; metal matrix composites; shape control during processing; non-destructive testing. Part 7 Diffusion bonding: the nature of diffusion bonding; HIP diffusion bonding; encapsulation; HIP parameters; use of interlayers; applications; evaluation of diffusion bonded joints. Part 8 Specialized applications: fabrication of optical materials; consolidation of carbon/carbon composites; synthesis of ceramics; pressure oxidation of silicon; gas encapsulation; high Tc superconductors. Part 9 HIPping in comparisons with other processes: uniaxial pressing and sintering; uniaxial pressing for diffusion bonding; cold isostatic pressing (CIP); pressure-assisted sintering (PAS); sinter/HIP; consolidation by atmospheric pressure (CAP); pseudo-HIP processes; powder injection moulding (PIM); dynamic powder compaction (DPC); powder pre-form consolidation by working; imporvements in forging; improved methods of casting; spray-forming; semi-solid processing; costs of HIPping and integration into the manufacturing route; future developments.


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Product Details
  • ISBN-13: 9780750300735
  • Publisher: Kluwer Academic Publishers Group
  • Publisher Imprint: Kluwer Academic Publishers
  • Height: 234 mm
  • No of Pages: 190
  • Width: 156 mm
  • ISBN-10: 0750300736
  • Publisher Date: 31 Dec 1991
  • Binding: Hardback
  • Language: English
  • Returnable: Y


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