Integrating Reliability with the Design Stage of Electronic Products
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Integrating Reliability with the Design Stage of Electronic Products

Integrating Reliability with the Design Stage of Electronic Products


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About the Book

This report explores why a reliability study is worthwhile for most manufactured electronic products. Useful comment is made on the physical factors affecting component reliability, and the myth that reliability is a totally mathematical concept is removed. Awareness is generated of the more general implications of reliability. After an introduction, the relationships between costs and benefits are looked at. The underlying definitions associated with reliability are discussed. Designing for reliability, and including reliability in the earliest stages of design are considered. How reliability apportionment can focus design effort where it is most required, and techniques that can enhance reliability during design are studied. The use of Built in Test (BIT) is looked at including: the types of BIT available, benefits, applications and difficulties in setting BIT tolerances. A typical reliability analysis is demonstrated by a case study on an existing production electronic unit, which includes a wide range of components from microprocessors and control logic through low and medium power components to high power output devices. A design technology review looks at the technology of the devices used in the design and manufacture of the unit and sub-assemblies. Areas where reliability improvements could be made are identified and summarized. There is an introduction to reliability modelling and databases including available tools, and the methodology of a reliability analysis is presented. Then component stress analysis is carried out using a commercially available reliability software package, firstly for each sub-assembly of the unit and then for the whole system. Full details of the calculation results are provided in appendices. The report discusses how data from field service records and customer feedback can be used to identify reliability problems and improve design and manufacture. It looks at the factors that effect the reliability of electronic components including: stress factors such as temperature, corrosion, voltage stress, vibration, wear and humidity, also failure mechanisms due to chemical and physical changes such as alloy formation in semiconductor devices, ion migration, impurities and dirt contamination. A guide to the implementation of a reliability analysis strategy is provided in the


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Product Details
  • ISBN-13: 9780700806386
  • Publisher: ERA Technology Ltd
  • Publisher Imprint: ERA Technology Ltd
  • Height: 297 mm
  • ISBN-10: 0700806385
  • Publisher Date: /02/1997
  • Binding: Spiral bound
  • Width: 210 mm


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