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Home > Science, Technology & Agriculture > Electronics and communications engineering > Electronics engineering > Electronics: circuits and components > Plastic Encapsulation of Microelectronics: Materials, Processes, Quality, Reliability and Applications
Plastic Encapsulation of Microelectronics: Materials, Processes, Quality, Reliability and Applications

Plastic Encapsulation of Microelectronics: Materials, Processes, Quality, Reliability and Applications


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About the Book

This study addresses issues relevant to PEM devices and the assemblies that incorporate PEMs, including materials, processes, screens, tests, failure mechanisms, reliability and the applications of PEMs that may be specific to environmental conditions. The text documents existing research and supports all activities that are currently underway throughout the world to establish the universal applicability of PEMs.

Table of Contents:
Plastic Packaging Materials; Manufacturing Processes; Assembly Onto Printed Wiring Boards; Packing and Handling; Failure Mechanisms, Sites, and Modes; Quality Assurance; Qualification and Accelerated Testing; Defect Analysis Techniques; Trends and Challenges; Glossary; Index.

About the Author :
MICHAEL G. PECHT is a tenured faculty member at the University of Maryland with a joint appointment in systems research and mechanical engineering. He is Chief Editor of the IEEE Transactions on Reliability and is on the editorial board of the Journal of Electronics Manufacturing and the IEEE SPECTRUM. Dr. Pecht is a Professional Engineer and an IEEE Fellow with a BS in acoustics, an MS in electrical engineering, and an MS and PhD in engineering mechanics from the University of Wisconsin. Dr. Pecht is the Director of the CALCE Electronic Packaging Research Center. LUU T. NGUYEN received his PhD in mechanical engineering from MIT in 1984 on a John and Fannie Hertz Foundation Fellowship. He is currently a program manager with the Package Technology Group at National Semi-conductor Corp., Santa Clara, California, working on several ARPA and Department of Defense-funded contracts on MCMs, single chip packaging assembly reliability, and design manufacturing issues. He also serves as a Packaging Technical Advisory Board member for the Semiconductor Research Corporation. Previously, he was with the Philips R&D Center in Sunnyvale, California, and the IBM T. J. Watson Research Center in Yorktown Heights, New York. He has 5 book chapters, 7 patents, 15 invention disclosures, over 70 technical papers, and over 40 general science story features. He is a coeditor of two books. He has two Best Paper Awards and several technical awards from NASA for design work on the Viking and Mars Orbiter spacecrafts while interning atthe Jet Propulsion Laboratory, Pasadena. EDWARD B. HAKIM is chief of the Reliability, Testability and Quality Assurance Branch, Electronics Tech-nology and Devices Laboratory, U.S. Army Laboratory Command, Fort Monmouth, New Jersey. For more than 30 years, he has been involved in Army microelectronics and semiconductor reliability R&D. Mr. Hakim has presented more than 50 technical papers and has written the text, Micro-electronic Reliability, Volume I: Reliability, Test, and Diagnostics. He has served on numerous committees, including the Defense Science Board Task Force on Commercial Components- Electronic Devices, the Department of Defense (DoD) Industry Task Force on Electrostatic Discharge, the DoD Microcircuit Planning Group, and the DoD/Industry Coordination Working Group on Generic Qualification.


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Product Details
  • ISBN-13: 9780471306252
  • Publisher: John Wiley and Sons Ltd
  • Publisher Imprint: John Wiley & Sons Inc
  • Height: 243 mm
  • Returnable: N
  • Weight: 850 gr
  • ISBN-10: 0471306258
  • Publisher Date: 20 Feb 1995
  • Binding: Hardback
  • Language: English
  • Sub Title: Materials, Processes, Quality, Reliability and Applications
  • Width: 163 mm


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