Reliability Technology: Principles and Practice of Failure Prevention in Electronic Systems(Quality and Reliability Engineering Series)

A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA  Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples 

Table of Contents:
Foreword by Michael Pecht ix Series Editor’s Preface xi Preface xiii About the Author xvii Acknowledgements xix 1 The Origins and Evolution of Quality and Reliability 1 1.1 Sixty Years of Evolving Electronic Equipment Technology 1 1.2 Manufacturing Processes – From Manual Skills to Automation 3 1.3 Soldering Systems 4 1.4 Component Placement Machines 5 1.5 Automatic Test Equipment 5 1.6 Lean Manufacturing 5 1.7 Outsourcing 9 1.8 Electronic System Reliability – Folklore versus Reality 9 1.9 The ‘Bathtub’ Curve 11 1.10 The Truth about Arrhenius 13 1.11 The Demise of MIL-HDBK- 217 15 1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products 18 1.13 The MoD SMART Procurement Initiative 20 1.14 Why do Items Fail? 21 1.15 The Importance of Understanding Physics of Failure (PoF) 23 Summary and Questions 23 References 25 2 Product Lifecycle Management 27 2.1 Overview 27 2.2 Project Management 29 2.3 Project Initiation 31 2.4 Project Planning 33 2.5 Project Execution 38 2.6 Project Closure 41 2.7 A Process Capability Maturity Model 42 2.8 When and How to Define The Distribution Strategy 47 2.9 Transfer of Design to Manufacturing – The High-Risk Phase 48 2.10 Outsourcing – Understanding and Minimising the Risks 49 2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century 50 Summary and Questions 51 References 52 3 The Physics of Failure 53 3.1 Overview 53 3.2 Background 54 3.3 Potential Failure Mechanisms in Materials and Components 56 3.4 Techniques for Failure Analysis of Components and Assemblies 71 3.5 Transition from Tin-Lead to Lead-Free Soldering 75 3.6 High-Temperature Electronics and Extreme-Temperature Electronics 77 3.7 Some Illustrations of Failure Mechanisms 79 Summary and Questions 86 References 87 4 Heat Transfer – Theory and Practice 89 4.1 Overview 89 4.2 Conduction 90 4.3 Convection 96 4.4 Radiation 100 4.5 Thermal Management 106 4.6 Principles of Temperature Measurement 106 4.7 Temperature Cycling and Thermal Shock 110 Summary and Questions 111 References 112 5 Shock and Vibration – Theory and Practice 113 5.1 Overview 113 5.2 Sources of Shock Pulses in the Real Environment 114 5.3 Response of Electronic Equipment to Shock Pulses 115 5.4 Shock Testing 116 5.5 Product Shock Fragility 120 5.6 Shock and Vibration Isolation Techniques 126 5.7 Sources of Vibration in the Real Environment 133 5.8 Response of Electronic Equipment to Vibration 134 5.9 Vibration Testing 134 5.10 Vibration-Test Fixtures 139 Summary and Questions 145 References 147 6 Achieving Environmental-Test Realism 149 6.1 Overview 149 6.2 Environmental-Testing Objectives 150 6.3 Environmental-Test Specifications and Standards 152 6.4 Quality Standards 157 6.5 The Role of the Test Technician 158 6.6 Mechanical Testing 159 6.7 Climatic Testing 164 6.8 Chemical and Biological Testing 168 6.9 Combined Environment Testing 169 6.10 Electromagnetic Compatibility 175 6.11 Avoiding Misinterpretation of Test Standards and Specifications 179 Summary and Questions 181 References 183 7 Essential Reliability Technology Disciplines in Design 185 7.1 Overview 185 7.2 Robust Design and Quality Loss Function 186 7.3 Six Sigma Quality 192 7.4 Concept, Parameter and Tolerance Design 195 7.5 Understanding Product Whole Lifecycle Environment 199 7.6 Defining User Requirement for Failure-Free Operation 203 7.7 Component Anatomy, Materials and Mechanical Architecture 205 7.8 Design for Testability 206 7.9 Design for Manufacturability 211 7.10 Define Product Distribution Strategy 213 Summary and Questions 215 References 216 8 Essential Reliability Technology Disciplines in Development 217 8.1 Overview 217 8.2 Understanding and Achieving Test Realism 218 8.3 Qualification Testing 219 8.4 Stress Margin Analysis and Functional Performance Stability 219 8.5 Premature Failure Stimulation 229 8.6 Accelerated Ageing vs. Accelerated Life Testing 229 8.7 Design and Proving of Distribution Packaging 232 Summary and Questions 247 References 248 9 Essential Reliability Technology Disciplines in Manufacturing 251 9.1 Overview 251 9.2 Manufacturing Planning 252 9.3 Manufacturing Process Capability 253 9.4 Manufacturing Process Management and Control 257 9.5 Non-invasive Inspection Techniques 267 9.6 Manufacturing Handling Procedures 269 9.7 Lead-Free Soldering – A True Perspective 279 9.8 Conformal Coating 281 9.9 Production Reliability Acceptance Testing 287 Summary and Questions 288 References 289 10 Environmental-Stress Screening 291 10.1 Overview 291 10.2 The Origins of ESS 291 10.3 Thermal-Stress Screening 294 10.4 Developing a Thermal-Stress Screen 313 10.5 Vibration-Stress Screening 315 10.6 Developing a Vibration-Stress Screen 317 10.7 Combined Environment-Stress Screening 326 10.8 Other Stress Screening Methodologies 327 10.9 Estimating Product Life Consumed by Stress Screening 328 10.10 An Environmental-Stress Screening Case Study 329 Summary and Questions 334 References 335 11 Some Worked Examples 337 11.1 Overview 337 11.2 Thermal Expansion Stresses Generated within a PTH Due to Temperature Cycling 340 11.3 Shear Tear-Out Stresses in Through-Hole Solder Joints 342 11.4 Axial Forces on a Through-Hole Component Lead Wire 346 11.5 SMC QFP – Solder-Joint Shear Stresses 348 11.6 Frequency and Peak Half-Amplitude Displacement Calculations 357 11.7 Random Vibration – Converting G2/Hz to GRMS 358 11.8 Accelerated Ageing – Temperature Cycling and Vibration 360 11.9 Stress Screening – Production Vibration Fixture Design 363 References 365 Appendix 1: Physical Properties of Materials 367 Appendix 2: Unit Conversion Tables 377 Index 383

About the Author :
Mr. Norman Pascoe, MIT Consultant (retired), UK The author has worked for forty three years in the fields of Environmental Testing , Quality and Reliability and Environmental Stress Screening. Since 1996 he has worked as a Reliability Technology consultant to some leading telecommunications and aerospace industries. Before becoming a consultant Norman served for five years as European Product Assurance adviser to Nortel Networks Limited. Mr Pascoe has presented papers at seminars and conferences in North America, the UK and other European countries. He became a member of the Society of Environmental Engineers in December 1987 and was elected a Fellow of the Society of Environmental Engineers in April 1998.