Plasma Processing for Semiconductor Materials and Thin-Film Devices: (Vacuum and Thin-Film Deposition Technologies)

Plasma Processing for Semiconductor Materials and Thin-Film Devices covers the state-of-the-art in plasma processing of thin films. The book focuses on fundamental plasma theory, plasma for advanced applications, advanced characterization techniques, plasma and performance in semiconductor devices, and plasma processing. Sections consider the fundamental physics of plasma then move to advanced applications in the processing of semiconductor materials and their relation to the performance of semiconductor thin film devices. Subsequently, the book investigates the adoption of plasma for advanced (including thin film) characterization methods, finally addressing emerging plasma technologies such as liquid plasma, cold atmospheric plasma, and advanced plasma techniques. This book will be of interest to students, researchers, and practitioners in any field that utilizes plasma processing, since its chapters have been written by leading authorities from both academia and industry.

Table of Contents:
Section I: Background and introduction to plasma science 1. Plasma physics and applications 2. Plasma diagnostic theory and methods 3. Modelling of plasma chemistry Section II: Plasma processing: Thin Film Deposition 4. Advanced physical vapor deposition (HiPIMS, etc) 5. Advanced chemical vapor deposition (PE-ALD, etc) 6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition 7. Plasma Jet Deposition 8. Simulation of plasma model for metallic thin film deposition Section III: Plasma processing: Surface modification of thin films 9. Surface functionalization of narrow bandgap semiconductors 10. Surface functionalization of Si, SiGe, and Ge semiconductors 11. Surface functionalization of wide bandgap semiconductors 12. Surface functionalization of ultra-wide bandgap semiconductors 13. Surface functionalization of advanced polymeric materials 14. Surface functionalization of metallic surface modification Section IV: Thin film etching and other plasma-enabled processes 15. Low temperature plasma etching technology 16. Etching technology for narrow bandgap semiconductor 17. Etching technology for Si, SiGe, and Ge semiconductor 18. Etching technology for wide bandgap semiconductor 19. Etching technology for ultra-wide bandgap semiconductor 20. Advances of plasma atomic layer etching technology 21. Plasma dicing technology Section V: Energy, sensor and environmental applications of liquid plasma processing 22. Synthesis of semiconductor nanomaterials for energy applications 23. Environmental sensors via liquid plasma processing Section VI: Other advanced (thin film) plasma processing methods 24. Cold atmospheric plasma 25. Laser induced plasma 26. Plasma for 3D printing 27. Development of advanced plasma technology for semiconductor device thin film applications 28. Advances of plasma etching technology for 3D advanced packaging for high density memory devices Section VII: Plasmas for advanced and thin film characterization techniques 29. Glow Discharge Mass Spectrometry (GD-MS) 30. Glow Discharge Optical Emission Spectroscopy (GD-OES) 31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS) 32. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES) Section VIII: Plasma and performance of semiconductor thin film devices 33. Enhancement of device performance with plasma treatment 34. Plasma induced damages and material defects related to device performance 35. Plasma for wafer bonding

About the Author :
Kuan Yew Cheong is a Professor in the School of Materials and Mineral Resources Engineering at Universiti Sains Malaysia (USM). He specializes in semiconductor materials, electronic packaging, nanomaterials, and surface engineering, recognized as a top 2% researcher in applied physics/materials (2023). He has contributed to research on bio-organic-based memory to address e-waste. Behnam Akhavan is an Associate Professor of Biomedical Engineering at the University of Newcastle, Australia, where he heads the Plasma Bio-engineering Research Group. His Lab develops new plasma science and surface engineering solutions for a range of modern applications, including plasma surface engineering of bone implants, cardiovascular devices, and artificial nerves; plasma polymer nanoparticles for drug delivery; electrochromic coatings for wearable electronics; and micro/nano particles for toxin removal and water purification. Shih-Nan Hsiao is a Professor at the Center for Low-temperature Plasma Sciences, Nagoya University, Japan. His research interests include cryogenic plasma etching, atomic layer etching, plasma diagnostics, and simulations for semiconductor processes. Sheng-Chi Chen is a Professor in the Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on nanotechnology applications, particularly in the fields of information storage, transparent conductive oxide and nitride films, as well as magnetic films. He specializes in plasma and thin-film processes and analyses of nanomaterial thin films deposited via sputtering, evaporation, and atomic layer deposition (ALD) processes. Phuoc Huu Le is an Associate Professor at the Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on the development and characterization of thin films, including thermoelectric materials, topological insulators, transparent conducting oxides, metal oxides, and half-Heusler compounds. He is also deeply engaged in the fabrication of nanomaterials through plasma-based and physical-chemical methods, with applications spanning photochemical water splitting, electrochemical sensors, and nanophotocatalysts for the degradation of emerging pollutants and contaminants.