Surface Mount Technology
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Surface Mount Technology: Principles and Practice

Surface Mount Technology: Principles and Practice


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About the Book

This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices and technology options. The chapters are a "walk-through" of the actual assembly process. An additional chapter discusses the effect of high pin count devices (fine pitch, BGA and PGA) and their impact on the board assembly. Included is an appendix of vendors for components, sockets, material processes and equipment. Expanded coverage of water soluble paste, no clean paste and lead free solder addressses the environmental issues new to this industry.

Table of Contents:
Introduction to surface moubting design; surface mounting manufacturing. Appendix: surface mount standards.


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Product Details
  • ISBN-13: 9780442018627
  • Publisher: Kluwer Academic Publishers Group
  • Publisher Imprint: Kluwer Academic Publishers
  • Edition: Revised edition
  • Language: English
  • Sub Title: Principles and Practice
  • Width: 153 mm
  • ISBN-10: 0442018622
  • Publisher Date: /01/1996
  • Binding: Hardback
  • Height: 229 mm
  • Returnable: N
  • Weight: 333 gr


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