Principles of Power Integrity for PDN Design--Simplified: Robust and Cost Effective Design for High Speed Digital Products

This guide's authors are the industry's leading experts in signal integrity and PDN. Smith has over 30 years' experience in electronics, system and PDN design at IBM, Sun Microsystems and Altera Corporation, and has architected today's most popular systematic approach to PDN design. Bogatin also has more than 30 years' experience in signal integrity, and has written the field's most popular SI text book, Signal and Power Integrity-Simplified. Here, they thoroughly illuminate the core principles at the foundation of PDN performance, including impedance, resonance, inductance, and signal propagation. They offer practical insights for understanding noise sources, and show how design features affect noise. Next, they help readers strengthen their intuition about how physical design decisions affect electrical performance, and complement their intuition with detailed analysis to carefully balance cost and robustness.   Readers will find valuable rules of thumb, analytical approximations, examples of numerical simulations, and practical coverage of all PDN elements, from chip features to package, board, and voltage regulator module (VRM). The authors show to use measurement to anchor your designs to reality, characterizing components in the frequency domain, and characterizing systems in the time domain. They review the principles behind each measurement technique, as present multiple examples of measured performance of real world components and systems.

Table of Contents:
1. Why PDN Design is in Your Future 2. Essential Principles 3. Measuring Low Impedances 4. Inductance 5. Lowest Frequency PDN Design 6. Highest Frequency PDN Design 7. Practical Integration of MLCC Capacitors 8. Properties of Planes 9. Planes and Capacitors 10. System Level Design: The Ecology of the PDN 11. Optimizing Capacitor Values 12. Transient Noise Voltages 13. Transfer Noise: Power Supply Crosstalk across Boundaries 14. Technology Options 15. Case Studies

About the Author :
Larry D. Smith is a Principal Power Integrity Engineer at Qualcomm. Prior to joining Qualcomm in 2011, he worked at Altera from 2005 to 2011 and Sun Microsystems from 1996 to 2005, where he did development work in the field of signal and power integrity. Before this, he worked at IBM in the areas of reliability, characterization, failure analysis, power supply and analog circuit design, packaging, and signal integrity. Mr. Smith received the BSEE degree from Rose-Hulman Institute of Technology and the MS degree in material science from the University of Vermont. He has more than a dozen patents and has authored numerous journal and conference papers. Eric Bogatin is currently the Dean of the Teledyne LeCroy Signal Integrity Academy, at www.beTheSignal.com, an Adjunct Professor at the University of Colorado-Boulder in the ECEE department, and editor of the Signal Integrity Journal (www .SignalIntegrityJournal.com). Bogatin received his BS in physics from MIT and MS, and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. He has written six technical books in the field and presented classes and lectures on signal integrity worldwide. In 2011, his company Bogatin Enterprises, which he founded with his wife Susan in 1990, was acquired by Teledyne LeCroy. After concluding his live public classes in 2013, he devoted his efforts into creating the Signal Integrity Academy, a web portal to provide all of his classes and training content online for individuals and for companies. In addition to lecturing and writing on signal and power integrity topics, Bogatin also writes science fiction novels. The first in a series, Shadow Engineer, was published in 2016.