Printed Circuit Assembly Design
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Printed Circuit Assembly Design

Printed Circuit Assembly Design


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About the Book

Nuts-and-bolts guide to designing printed circuit assemblies Want to build circuit boards for today's smaller, faster electronics applications? This how-to tutorial puts a PCA design roadmap at your fingertips--valuable whether you're neophyte just starting out or an experienced designer, engineer or a manager associated with the electronics industry, as printed circuit assemblies are key building blocks in almost every commodity made today with any electronics content.In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.

Table of Contents:
Chapter 1: Introduction. Chapter 2: Key Factors Influencing Design. Chapter 3: Design Process Flow. Chapter 4: Circuit Board Layout. Chapter 5: Design Quality. Chapter 6: Documentation. Chapter 7: Design Revisions. Chapter 8: Design Organization and Management. Appendix A: Glossary. Appendix B: CCA Failure Mechanisms and Reliability Issues.

About the Author :
Leonard Marks has over 35 years of aerospace and commercial industry experience in printed circuit assembly design and manufacturing. He was a pioneer in the use of computer-aided systems for circuit board layout, and has implemented and managed CAE/CAD/CAM systems at several major corporations. Mr. Marks’ manufacturing background includes installation and operation of state-of-the-art circuit board fabrication, assembly and test facilities at three different sites. Mr. Marks served on the board of directors of the International Microelectronics and Packaging Society, and was on the staff of Electronic Packaging and Production Magazine as contributing editor. He is a graduate of the Polytechnic University of New York. James A. Caterina has over 28 years of experience designing printed circuit assemblies for several major military and industrial electronics manufacturing companies. He is manager of the printed circuit design group at Northrop Grumman’s Illinois facility. Mr. Caterina has contributed to the development of several IPC standards.


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Product Details
  • ISBN-13: 9780070411074
  • Publisher: McGraw-Hill Education - Europe
  • Publisher Imprint: McGraw-Hill Professional
  • Height: 236 mm
  • No of Pages: 368
  • Spine Width: 37 mm
  • Width: 163 mm
  • ISBN-10: 0070411077
  • Publisher Date: 16 Aug 2000
  • Binding: Hardback
  • Language: English
  • Returnable: N
  • Weight: 737 gr


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