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1.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED254
Binding:
Paperback
Release:
30 Jun 2020
Language:
English
International Edition
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2.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED586
Binding:
Digital (delivered electronically)
Release:
25 Jan 2017
Language:
English
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3.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED231
Binding:
Digital (delivered electronically)
Release:
19 Sep 2017
Language:
English
Out of Stock
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4.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED221
Binding:
Digital (delivered electronically)
Release:
19 Sep 2017
Language:
English
Out of Stock
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5.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED221
Binding:
Digital (delivered electronically)
Release:
19 Sep 2017
Language:
English
Out of Stock
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6.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By:
Xing-Chang Wei
Publisher:
Taylor & Francis Ltd
No Review Yet
AED104
Binding:
Hardback
Release:
25 May 2017
Language:
English
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