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1.
Zinc Oxide and Related Materials — 2009: Volume 1201
By:
Steven M. Durbin
,
Holger von Wenckstern
,
Martin W. Allen
Publisher:
Materials Research Society
No Review Yet
AED502
Binding:
Hardback
Release:
31 Mar 2010
Language:
English
International Edition
Ships within
14-16 Days
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2.
Oxide Semiconductors and Thin Films: Volume 1494
By:
Martin Allen
,
Steven M. Durbin
,
André Schleife
,
Christof W. Schneider
,
Craig B. Arnold
Publisher:
Materials Research Society
No Review Yet
AED355
Binding:
Hardback
Release:
28 Oct 2013
Language:
English
International Edition
Ships within
12-14 Days
Explain..
3.
Engineering Circuit Analysis
By:
Steven M. Durbin
,
William H. Hayt
,
Jack E. Kemmerly
,
Steven Durbin
Publisher:
McGraw-Hill Education - Europe
No Review Yet
AED181
Binding:
SA
Release:
/11/2001
Language:
English
Out of Stock
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4.
Engineering Circuit Analysis
By:
J Kemmerly
,
Steven M. Durbin
,
W Hayt
Publisher:
McGraw Hill Education India
No Review Yet
AED40
Binding:
Paperback
Release:
06 Jul 2010
Out of Stock
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5.
Loose Leaf for Engineering Circuit Analysis
By:
William H Hayt
,
Steven M Durbin
,
Jack E Kemmerly
,
Jamie D Phillips
Publisher:
OM Book Service
No Review Yet
AED57
Binding:
Loose-leaf
Release:
25 Jan 2023
Language:
English
Out of Stock
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6.
Engineering Circuit Analysis
By:
Steven M. Durbin
,
William Hayt
,
Jack Kemmerly
Publisher:
McGraw-Hill Science/Engineering/Math
No Review Yet
AED929
Binding:
Paperback
Release:
20 Feb 2007
Language:
English
Out of Stock
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7.
Connect Access Card for Engineering Circuit Analysis
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw-Hill Education
No Review Yet
AED409
Binding:
Digital online
Release:
09 Aug 2011
Language:
English
Out of Stock
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8.
Package: Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw-Hill Education
No Review Yet
AED37
Binding:
Loose-leaf
Release:
23 May 2012
Language:
English
Out of Stock
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9.
Loose Leaf Engineering Circuit Analysis
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw-Hill Education
No Review Yet
AED937
Binding:
Loose-leaf
Release:
07 Aug 2012
Language:
English
Out of Stock
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10.
Connect 2 Semester Access Card for Engineering Circuit Analysis
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw-Hill Education
No Review Yet
AED127
Binding:
LB
Release:
04 Apr 2018
Language:
English
Out of Stock
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11.
Connect 1 Semester Access Card for Engineering Circuit Analysis
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw-Hill Education
No Review Yet
AED40
Binding:
LB
Release:
04 Apr 2018
Language:
English
Out of Stock
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12.
Loose Leaf for Engineering Circuit Analysis
By:
Jack Kemmerly
,
William H Hayt
,
Steven M Durbin
Publisher:
McGraw Hill Education India
No Review Yet
AED749
Binding:
Loose-leaf
Release:
23 Mar 2018
Language:
English
Out of Stock
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