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Chuan Seng Tan
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1.
Physical Design for 3D Integrated Circuits
By:
Chuan Seng Tan
,
Aida Todri-Sanial
Publisher:
Taylor & Francis Ltd
No Review Yet
AED361
Binding:
Paperback
Release:
31 Mar 2021
Language:
English
International Edition
Ships within
18-20 Days
Explain..
2.
3D Integration for VLSI Systems
By:
Chuan Seng Tan
,
Kuan-Neng Chen
,
Steven J. Koester
Publisher:
Pan Stanford Publishing Pte Ltd
No Review Yet
AED611
Binding:
Hardback
Release:
26 Sep 2011
Language:
English
International Edition
Ships within
18-20 Days
Explain..
3.
Physical Design for 3D Integrated Circuits
By:
Chuan Seng Tan
,
Aida Todri-Sanial
Publisher:
Taylor & Francis Inc
No Review Yet
AED872
Binding:
Hardback
Release:
18 Dec 2015
Language:
English
International Edition
Ships within
18-20 Days
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4.
Wafer Level 3-D ICs Process Technology
By:
Chuan Seng Tan
,
L. Rafael Reif
,
Ronald J. Gutmann
Publisher:
Springer-Verlag New York Inc.
No Review Yet
AED693
Binding:
Hardback
Release:
19 Sep 2008
Language:
English
International Edition
Ships within
14-16 Days
Explain..
5.
Advances In 3d Integrated Circuits And Systems
By:
Chuan Seng Tan
,
Hao Yu
Publisher:
World Scientific Publishing Co Pte Ltd
No Review Yet
AED662
Binding:
Hardback
Release:
16 Oct 2015
Language:
English
International Edition
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18-20 Days
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6.
Wafer Level 3-D ICs Process Technology
By:
Chuan Seng Tan
,
L. Rafael Reif
,
Ronald J. Gutmann
Publisher:
Springer-Verlag New York Inc.
No Review Yet
AED692
Binding:
Paperback
Release:
08 Dec 2010
Language:
English
International Edition
Ships within
14-16 Days
Explain..
7.
Advances In 3d Integrated Circuits And Systems
By:
Chuan Seng Tan
,
Hao Yu
Publisher:
World Scientific Publishing Co Pte Ltd
No Review Yet
AED269
Binding:
Paperback
Release:
16 Oct 2015
Language:
English
International Edition
Ships within
18-20 Days
Explain..
8.
Physical Design for 3D Integrated Circuits
By:
Chuan Seng Tan
,
Aida Todri-Sanial
Publisher:
Taylor & Francis Ltd
No Review Yet
AED317
Binding:
Digital (delivered electronically)
Release:
19 Dec 2017
Language:
English
Out of Stock
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9.
Physical Design for 3D Integrated Circuits
By:
Chuan Seng Tan
,
Aida Todri-Sanial
Publisher:
Taylor & Francis Ltd
No Review Yet
AED317
Binding:
Digital (delivered electronically)
Release:
19 Dec 2017
Language:
English
Out of Stock
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10.
Physical Design for 3D Integrated Circuits
By:
Chuan Seng Tan
,
Aida Todri-Sanial
Publisher:
Taylor & Francis Ltd
No Review Yet
AED82
Binding:
Digital (delivered electronically)
Release:
19 Dec 2017
Language:
English
Out of Stock
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11.
Wafer Level 3-D Ics Process Technology
By:
Chuan Seng Tan
,
L. Rafael Reif
,
Ronald J Gutmann
Publisher:
Springer-Verlag New York Inc.
No Review Yet
AED131
Binding:
Digital (delivered electronically)
Release:
01 Jan 2009
Language:
English
Out of Stock
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12.
Advances in 3D Integrated Circuits and Systems
By:
Hao Yu
,
Chuan-Seng Tan
Publisher:
World Scientific Publishing Company
No Review Yet
AED190
Binding:
Digital (delivered electronically)
Release:
28 Aug 2015
Language:
English
Out of Stock
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