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G H. Jack

G H. Jack

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1.
Classic Tales of Science Fiction & Fantasy
Classic Tales of Science Fiction & Fantasy
By: H. G. Wells , Sir Arthur Conan Doyle, Jules Verne, Jack London , Edgar Rice Burroughs
Publisher: Canterbury Classics
No Review Yet
AED86
Binding:
Leather / fine binding
Release:
24 Nov 2016
Language:
English
Available
Ships within 10-12 Days Explain..
2.
Improved Non-Steroid Anti-Inflammatory Drugs: COX-2 Enzyme Inhibitors
Improved Non-Steroid Anti-Inflammatory Drugs: COX-2 Enzyme Inhibitors
By: Jack H. Botting, Sir John R. Vane, R.M. Botting
Publisher: Springer
No Review Yet
AED331
Binding:
Paperback
Release:
25 Dec 2011
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Economic lot Size Determination in Multistage Assembly Systems
Economic lot Size Determination in Multistage Assembly Systems
By: Wallace B S Crowston, M H Wagner, Jack F Williams
Publisher: Hutson Street Press
No Review Yet
AED132
Binding:
Hardback
Release:
22 May 2025
Language:
English
International Edition
Ships within 14-16 Days Explain..
4.
Economic lot Size Determination in Multistage Assembly Systems
Economic lot Size Determination in Multistage Assembly Systems
By: Wallace B S Crowston, M H Wagner, Jack F Williams
Publisher: Hutson Street Press
No Review Yet
AED76
Binding:
Paperback
Release:
22 May 2025
Language:
English
International Edition
Ships within 14-16 Days Explain..
5.
Engineering Circuit Analysis || 10th Edition
Engineering Circuit Analysis || 10th Edition
By: Jack E. Kemmerly, Steven M. Durbin, Jamie D. Phillips, William H. Hayt, Jr
Publisher: McGraw Hill
No Review Yet
AED63
Binding:
Paperback
Release:
2024-10-25
Language:
English
Available
Ships within 2-4 Days Explain..
6.
ENGINEERING CIRCUIT ANALYSIS, 9TH EDITION
ENGINEERING CIRCUIT ANALYSIS, 9TH EDITION
By: Jr., William H. Hayt|Kemmerly, Jack E.|Phillips, Jamie D.|Durbin, Steven M., Durbin, Steven M., Kemmerly, Jack E., Phillips, Jamie D., Jr., William H. Hayt
Publisher: McGraw Hill
No Review Yet
AED73
Binding:
Paperback
Release:
05 Nov 2020
Language:
English
Available
Ships within 2-4 Days Explain..
7.
Qualitative Research Methods in English Medium Instruction for Emerging Researchers
Qualitative Research Methods in English Medium Instruction for Emerging Researchers
By: Samantha M. Curle, Jack K. H. Pun
Publisher: Taylor & Francis Ltd
No Review Yet
AED90
Binding:
Paperback
Release:
29 Nov 2024
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Loose Leaf for Engineering Circuit Analysis
Loose Leaf for Engineering Circuit Analysis
By: William H Hayt, Steven M Durbin, Jack E Kemmerly, Jamie D Phillips
Publisher: OM Book Service
No Review Yet
AED930
Binding:
Loose-leaf
Release:
25 Jan 2023
Language:
English
International Edition
Ships within 24-26 Days Explain..
9.
Qualitative Research Methods in English Medium Instruction for Emerging Researchers
Qualitative Research Methods in English Medium Instruction for Emerging Researchers
By: Samantha M. Curle, Jack K. H. Pun
Publisher: Taylor & Francis Ltd
No Review Yet
AED223
Binding:
Hardback
Release:
20 Jun 2023
Language:
English
Available
Ships within 12-14 Days Explain..
10.
The Use of Technology in English Medium Education
The Use of Technology in English Medium Education
By: Dogan Yuksel, Samantha Curle, Jack K. H. Pun
Publisher: Springer Nature Switzerland AG
No Review Yet
AED611
Binding:
Paperback
Release:
08 Jun 2023
Language:
English
International Edition
Ships within 14-16 Days Explain..
11.
The Use of Technology in English Medium Education
The Use of Technology in English Medium Education
By: Dogan Yuksel, Samantha Curle, Jack K. H. Pun
Publisher: Springer Nature Switzerland AG
No Review Yet
AED616
Binding:
Hardback
Release:
07 Jun 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
12.
Research Methods in English Medium Instruction
Research Methods in English Medium Instruction
By: Samantha M. Curle, Jack K.H. Pun
Publisher: Taylor & Francis Ltd
No Review Yet
AED176
Binding:
Hardback
Release:
20 Jul 2021
Language:
English
Available
Ships within 12-14 Days Explain..
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